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3.3. Environmental Specifications
Operating Conditions
Requirements
Property
Min.
Max.
Unit
Ambient air temperature range
0
50
°C
32
122
°F
FPGA die temperature
85
°C
185
°F
Processor die temperature
105
°C
221
°F
Ambient humidity range (1)
10
90
% RH
Condition (1):
non-condensing
Dissipated power
Property
Typ.
Unit
Thermal value (2)
35.8
BTU/h
10.5
W
Condition (2):
operating temperature range, full encoding workload
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