EPOX EP-BX5C, Руководство пользователя

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Introduction EP-BX5C
Page 1-3
The entire enclosed product is called the Pentium
®
II or Pentium
®
III Processor.
The packaging technology and each of the physical elements of the product are
referred to using accurate technical descriptions. This allows clear reference to
the products as just a processor. This is the model used in past packaging tech-
nologies like PGA, TCP, PQFP, DIP, etc.
S.E.C. Cartridge Terminology
• Pentium
®
II or Pentium
®
III Processor
The new enclosed card packaging technology is called a “Single Edge
Contact cartridge.” This is similar to previous names for packaging
technology such as PGA or TCP.
• Processor card
The green PCB (with or without components on it)
• Processor core
The silicon on the PLGA package on the PCB
• Cover
The plastic cover on the opposite side from the thermal plate.
• Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium
®
Pro
processor uses Socket 8.
• Retention mechanism
Formerly ‘retention module’ the dual posts, etc. that holds the cartridge in
place.
• Thermal plate
The heatsink attach-
ment plate.
• Heat sink supports
The support pieces that
are mounted on the
mainboard to provide
added support for
heatsinks.
Figure 1: Pentium
®
II/III Processor CPU
with S.E.C.C. or S.E.C.C.2 Package
Pentium
®
II Processor
in an S.E.C.C. Package
Pentium ® III Processor
in an S.E.C.C.2 Package