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22

WEEE Disassembly Instructions for the

TAE and TAE-DC Disk Array Enclosure

11.0 Reportable Materials on TAE and TAE-DC Common

Components

Table 10 lists components that require selective treatment. Refer to Figure 3 through

Figure 11 to locate the item numbers listed.

Table 10 Complete list of Reportable Materials on TAE and TAE-DC Components

Material

Item Location

Polychlorinated biphenyl (PCB) containing

capacitors and all Polychlorinated Terphenyl

(PCT) containing electrical equipment

Absent

Mercury – containing components such as

switches or backlighting lamps

Absent

Batteries & Accumulators

Absent

Printed circuit boards of mobile phones generally,

and of other devices if the surface of the printed

circuit board is greater than 10 cm

2

9

11,20
15,25

29

21
22

LCC Assembly
LCC PCB
Power/Cooling Module
Top PCB
Bottom PCB
Chassis
Midplane PCB
2.5-inch Hard Disk Drive
SAS PCB
PCB

Ink & toner cartridges, liquid and pasty, as well as

color toner

Absent

Plastic containing brominated flame retardants

Absent

Asbestos waste and components which contain

asbestos

Absent

Cathode ray tubes

Absent

Chlorofluorocarbons (CFC),

Hydrochlorofluorocarbons (HCFC),

Hydrofluorocarbons (HFC)or,

Hydrocarbons (HC)

Absent

Gas discharge lamps

Absent

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Содержание TAE

Страница 1: ...e recyclers on how to identify and disassemble reportable materials in compliance with the Waste Electrical and Electronic Equipment WEEE directive The document does not replace disposal WEEE DISASSEM...

Страница 2: ...without notice The information in this publication is provided as is Dell makes no representations or warranties of any kind with respect to the information in this publication and specifically discla...

Страница 3: ...3 WEEE Disassembly Instructions for the TAE and TAE DC Disk Array Enclosure Part Number 300 015 574...

Страница 4: ...TAE and TAE DC 24 11 2 Precious Metals TAE and TAE DC 25 11 3 Plastic Part Markings TAE and TAE DC 25 12 0 Disassembly Details 26 12 0 1 Required Tools for Disassembly 26 12 0 2 Safety Precautions and...

Страница 5: ...ions for the TAE and TAE DC Disk Array Enclosure 13 0 4 3 Removing materials in the DC Power Cooling Module 41 13 0 5 Disassembling the Chassis for Recycling and Retrieving the Midplane PCB 43 14 0 Ro...

Страница 6: ...e following workflow to ensure the greatest efficiency in compliance with WEEE legislation 1 See 8 0 Product Photos to familiarize yourself with the hardware 2 Review the items listed in 11 0 Reportab...

Страница 7: ...7 WEEE Disassembly Instructions for the TAE and TAE DC Disk Array Enclosure http www emc com...

Страница 8: ...hromium Cu Copper DAE Disk Array Enclosure DIMMs Dual in line Memory Modules DPE Disk Processor Enclosure DRL Device Regulatory Label EMI Electromagnetic Interference ESD Electrostatic discharge EU Eu...

Страница 9: ...or PET Polyethylene Terephthalate PP Polypropylene PS Polystyrene Pt Platinum PVC Polyvinyl Chloride RoHS Restriction of Hazardous Substances SAS Serial Attached SCSI SP Storage Processor SPE Storage...

Страница 10: ...cess on the top of the product chassis Table 2 Product Regulatory Model Name and Specifications Product Regulatory Model Name TAE ships with two DC power supplies installed TAE DC ships with two DC po...

Страница 11: ...assembly Instructions for the TAE and TAE DC Disk Array Enclosure 8 0 Product Photos Figure 1 TAE or TAE DC front view fully populated with twenty five hard disk drives Figure 2 TAE or TAE DC rear vie...

Страница 12: ...Array Enclosure components Table 3 and Table 4 provide the disassembly sequence with links to disassembly procedures Item numbers below correspond with reportable materials listed in Table 10 through...

Страница 13: ...Figure 4 Link Control Card Assembly Table 4 Decoder and Disassembly Sequence Item Component Item Component 4 Connector Fence non ferrous 7 SAS Connector Cage not visible under air dam 5 Plastic LCC Gu...

Страница 14: ...ooling Module AC Type Figure 5 and Figure 6 identify power cooling module components Table 5 also provides the disassembly sequence with links to disassembly procedures Item numbers below correspond w...

Страница 15: ...Power Cooling Module PCBs Table 5 Decoder and Disassembly Sequence Item Component Item Component 10 Top Cover sheet metal 14 Wiring cable sheathing copper 11 Top PCB 15 Bottom PCB 12 Coils copper 16...

Страница 16: ...Power Cooling Module Figure 7 and Figure 8Figure 6 identify TAE DC power cooling module components Table 6 also provides the disassembly sequence with links to disassembly procedures Item numbers bel...

Страница 17: ...g Module PCB Table 6 Decoder and Disassembly Sequence Item Component Item Component 18 Top Cover sheet metal 23 Coils copper 19 Fan Pack Assembly ABS Plastic 24 Large Capacitor 20 Top PCB 25 Bottom PC...

Страница 18: ...bly procedures Item numbers below correspond with reportable materials listed in Table 10 through Table 12 For disassembly see Disassembling the Chassis for Recycling and Retrieving the Midplane PCB F...

Страница 19: ...e 8 TAE and TAE DC Accessories and Options Component Photo Disassembly Required AC Power Cord No See Table 10 Complete list of Reportable Materials on TAE and TAE DC Components DC Power Cord No See Ta...

Страница 20: ...rovides the disassembly sequence with links to disassembly procedures Item numbers below correspond with reportable materials listed in Table 10 through Table 12 Also see Removing and Disassembling a...

Страница 21: ...21 WEEE Disassembly Instructions for the TAE and TAE DC Disk Array Enclosure 10 0 TAE and TAE DC Disk Array Enclosure PCBs 2 5 inch Hard Disk Drive PCB SAS LCC PCB Midplane PCB...

Страница 22: ...ning components such as switches or backlighting lamps Absent Batteries Accumulators Absent Printed circuit boards of mobile phones generally and of other devices if the surface of the printed circuit...

Страница 23: ...tion of the product such as ionizing radiation Absent Electrolytic capacitors containing substances of concern height 25 mm diameter 25 mm or proportionately similar volume 13 24 Power Cooling Module...

Страница 24: ...Dam Power Cooling Module Top Cover and Carrier ABS 5 16 19 27 28 LCC Assembly Plastic LCC Guide Fan Pack Assembly Fan Blades and Assembly Midplane Assembly in Chassis Two Power Cooling Module Air Flap...

Страница 25: ...t Markings on TAE and TAE DC Components Part Name Weight ISO 11469 2000 Marking 2 5 inch Hard Disk Drive Carrier 132 g Lexan 3414R 40 GF Two Power Cooling Module Air Flappers 84 g PC ABS FR 40 Two LCC...

Страница 26: ...tices including all applicable health and safety regulations BATTERY WARNINGS Only trained personnel should handle the battery Danger of explosion if battery is incorrectly replaced Danger of explosio...

Страница 27: ...Documentation to obtain the appropriate WEEE instructions for EMC bezels 2 Press on the disk s latch button to release the latch 3 Pull the latch and slowly pull the disk from its slot Figure 13 Remo...

Страница 28: ...ly Instructions for the TAE and TAE DC Disk Array Enclosure 13 0 2 Removing an LCC 1 Press the orange handle buttons to release the LCC pull the latches outward 2 Remove the LCC from its slot Figure 1...

Страница 29: ...y from the LCC PCB 2 Remove the two screws that attach the plastic LCC guide circled and lift off of the PCB 3 Drill the four rivets that attach the air dam to the LCC assembly and remove the air dam...

Страница 30: ...hook type a Press down on one side of heat sink spring clip and unhook from the PCB circled b Lift the heat sink off of PCB Figure 17 Disengaging the LCC PCB heat sink 2 To access the LCC PCB a Remov...

Страница 31: ...isk Array Enclosure Figure 18 Removing the LCC PCB insulator 13 0 3 Removing and disassembling the power cooling module AC type 1 Press the orange handle button to release the module 2 Pull the latch...

Страница 32: ...32 WEEE Disassembly Instructions for the TAE and TAE DC Disk Array Enclosure Figure 19 Removing a power cooling module...

Страница 33: ...e power cooling module 1 Use a Phillips screwdriver to remove the three screws that attach the top cover to the power cooling module carrier a Remove the two screws on either side of the midplane conn...

Страница 34: ...bove the air dam 13 0 3 2 Power Cooling Module Top PCB 1 Remove four screws circled that attach the insulator and top PCB 2 Separate the insulator from the PCB and lift off it off Figure 22 Removing f...

Страница 35: ...ring from the PCB b Use wire cutters to cut the remaining end and remove the cable 2 To remove the coils circled a Flip over the top PCB and unsolder the coil s leads with a soldering iron b Lift off...

Страница 36: ...36 WEEE Disassembly Instructions for the TAE and TAE DC Disk Array Enclosure Figure 24 Removing top PCB materials Large C it...

Страница 37: ...coil c Flip over the top PCB and unsolder the coil s leads with a soldering iron d Lift off each coil 4 To remove the four small coils circled a Flip over the top PCB and unsolder the coil s leads wi...

Страница 38: ...ack assembly towards the middle and pull up to remove Figure 26 Locating the tabs on the fan pack assembly 3 To remove the fan pack assembly wiring you must first remove each individual fan a Remove e...

Страница 39: ...Figure 27 Removing each individual fan 13 0 4 Removing and disassembling the power cooling module DC type 1 Press the orange handle button to release the module 2 Pull the latch outward and remove the...

Страница 40: ...screwdriver to remove the two screws on the front of the unit see Figure 20 2 Turn the power cooling around and remove the third screw circled and lift off the top cover Figure 29 Removing the screw a...

Страница 41: ...losure Figure 30 Removing four top PCB screws 3 Disconnect the power cooling module wiring from the bottom PCB and remove the top PCB Figure 31 Removing the top PCB 13 0 4 3 Removing materials in the...

Страница 42: ...maining end and remove the cable 3 To remove the coils a Flip over the PCB and unsolder the coils leads with a soldering iron b Lift off each coil 4 To remove the capacitors a Use a solder iron to uns...

Страница 43: ...ttach the chassis top cover 5 Flip over the chassis and remove the four screws on the bottom of the chassis 6 Return the chassis to its front facing position to access the LCC housing 7 Remove the LCC...

Страница 44: ...44 WEEE Disassembly Instructions for the TAE and TAE DC Disk Array Enclosure...

Страница 45: ...s i e lead based alloys containing 85 by weight or more lead RoHS Exemption 7b Lead in solders for servers storage and storage array systems network infrastructure equipment for switching signaling tr...

Страница 46: ...46 WEEE Disassembly Instructions for the TAE and TAE DC Disk Array Enclosure...

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