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Chapter: Technical Data Thermal Specifications
page 92 ADL Embedded Solutions ADLQM67HDS
6.3 Thermal Specifications
The board is specified to operate in an environmental temperature range from -25°C to +70°C when using
an approved thermal solution, and an extended temperature range of -40°C to +85°C when pre-screened
for use with an approved thermal solution.
Maximum die temperature is 100°C. To keep the processor under this threshold an appropriate cooling
solution needs to be applied. This solution has to take typical and maximum power consumption into
account. The maximum power consumption may be twice as high and should be used as a basis for the
cooling concept. Additional controllers may also affect the cooling concept. The power consumption of such
components may be comparable to the consumption of the processor.
The board design includes thermal solution mounting points that will provide the best possible thermal
interface between die and solution. Since we take thermal solutions seriously we have several advanced,
aggressive cooling solutions in our product portfolio. Please contact your sales representative to order or
discuss your thermal solution needs.
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The end customer has the responsibility to ensure that the die temperature of the processor does not
exceed 100°C. Permanent overheating may destroy the board!
In case the temperature exceeds 100°C the environmental temperature must be reduced. Under certain
circumstances sufficient air circulation must be provided.