Table of Contents
1. Evaluation Kit Diagram
2. Evaluation Kit Setup
3. Evaluation Kit Features
4. Audio Test Method and Specifications
5. RF Test Method and Specifications
6. Sales and Support
1. Evaluation Kit Diagram
a. Antenna
e. 3.5mm Stereo Audio Jack
b. MR-284 Module
f. SB3 Interface Board
c. PB3 Reference Board
g. Power Switch
d. Power Jack
Your kit may be configured for up to 5-Nodes (1 Tx and up to 4 Rx nodes).
This kit is a digital wireless audio 2.0 channel solution. Rx node(s) can
have audio on both channels.
2. Evaluation Kit Setup
This MR-284 Evaluation kit is pre-assembled and pre-configured to work
of the box. Follow the simple steps outlined below to correctly setup and
begin using the evaluation kit.
1. Plug an audio cable into the audio jack on the Transmitter (Tx). Connect the
other end of the audio cable to an audio source, such as a portable media
player (Maximum input level is -3.5dBV).
2. Plug an audio cable into the audio jack on the Receiver (Rx). Connect the
other end of the cable to an audio amplifier, active speaker, or headphones.*
3. Connect the battery pack or AC adaptor (6V DC, 400mA) to the power jack on
the Tx and Rx.
4. Turn the power switches on both nodes to "on".
5. Make sure that antennas are in free space for best range, i.e. not resting
against a surface, PCB, or body.
Audio signals will begin transmission after step 4.
Please note that because this evaluation kit is electrostatic sensitive, it is
important to keep the Tx and Rx on electrostatic free surfaces.
*Headphones can be used for testing but since no headphone driver is included on the PB3 Rx board, the maximum
volume level may be lower than desired.
3. Evaluation Kit Features
The MR-284 system comes preloaded with application firmware called
“Standard Application”. This application firmware implements a number of
useful user interface features such as LED blinking and push button volume
control. It also supports customizable settings which can be loaded into the
modules over Two Wire Serial Interface (TWSI) or via the XPD programming
interface. These settings are stored in a “Parameter Page” which is a file stored in
non-volatile memory on the MR-284 module. This section provides a brief
summary of some commonly used features of the Standard Application. For a
full description refer to the document “Interfacing to WHAM2 Standard
Application” (Available from Eleven Engineering).
A. Bond LED:
The Bond LED displays the bond status between the Tx node
and the Rx nodes, as follows:
Solid On
Tx and Rx are bonded.
Flashing (Slow)
Node is searching for bond with its mate.
Flashing (Quick)
Tx is searching to bond with a new mate – Tx ONLY
Off
Board is powered off.
When configured in 5-Node mode, both Bond0 and Bond1 will start to flash
when the Tx is powered on. The first Rx that bonds to the Tx will cause the
Bond0 LED to turn solid green after which the Bond1 LED will continue to flash
until the Tx bonds to a second Rx. Bond0 LED will begin to flash again to bond
to a third Rx node. Once bonded, Bond1 LED will flash until a forth Rx node is
found. Once all four nodes have bonded, Bond0 LED and Bond1 LED will
remain solid green.
B. Mute LED:
The Mute LED displays the audio status of the Rx node, as
follows:
Solid On
Audio is automatically muted due to RF interference OR audio is manually
muted by User OR Rx is searching for bond
Off
Audio can play normally
MR-284 Evaluation Kit Operating Instructions
DO4711
MR
www.ElevenEngineering.com
Subject to change without notice.
DO4711|
2009.11.05
@2009 Eleven Engineering Inc. XInC
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and their associated logos are trademarks
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