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3. Place the iron in contact with the PC board foil.
Apply a small amount of solder simultaneously to
the foil and the component and allow them to melt
the solder.
4. Remove the iron and allow the solder to cool. The
solder should have flowed freely and not lump up
around the component.
5. Remove the tape and solder the other side of the
component.
When soldering the transistors, diodes and
integrated circuits, the following procedure may be
used:
1. Place the component on the PC board pads and secure in place with tape.
2. Apply a small amount of solder to the soldering iron tip.
3. Place the soldering iron tip on top of the component lead to be soldered and apply solder simultaneously to
the lead and the PC board foil.
4. Remove the iron and allow the solder to cool. The solder should have flowed freely and not lump up around
the component.
After a component is completely soldered, each solder joint should be inspected with a magnifying glass. If the
solder has not flowed smoothly, a bad solder joint is indicated. This occurs when the component and pad have
not been heated sufficiently. To correct, reheat the connection and if necessary add a small amount of additional
solder.
Another way to solder surface mount components is
as follows:
1. Apply a small amount of solder to the soldering
iron tip.
2. Using tweezers, hold the component on the PC
board pads.
3. Apply the soldering iron simultaneously to the
component and pad and allow the solder to flow
around the component.
4. Remove the soldering iron and allow the
connection to cool.
Solder
