ECS H57H-M, Руководство пользователя

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Introducing the Motherboard
Feature
• Accommodates Intel ® Lynnfield/Clarkdale processors
• Supports “Hyper-Threading” technology CPU
“Hyper-Threading” technology enables the operating system into thinking
it’s hooked up to two processors, allowing two threads to be run in parallel, both
on separate “logical” processors within the same physical processor.
The motherboard uses an LGA1156 type of socket that carries the following
features:
Processor
Chipset
• Supports DDR3 1333/1066 DDR3 SDRAM with Dual-channel architec-
ture
• Accommodates four unbuffered DIMMs
• Up to 4 GB per DIMM with maximum memory size up to 16 GB
• Supports 1 Gb, 2 Gb and 4 Gb DDR3 DRAM technologies for x8 and x16
devices (It is not recommended to use 512 Mb DDR3 memory device on
this motherboard)
Memory
Audio
• 7.1+2 Channel High Definition Audio Codec
• Meets Microsoft WLP3.x (Windows Logo Program) audio
requirements
• All DACs supports 44.1k/48k/96k/192kHz sample rate
• Software selectable 2.5V/3.2V/4.0V VREFOUT
• Direct Sound 3D. compatible
• Power Support: Digital: 3.3V; Analog: 5.0V
The Intel H57 Express Chipset is a single-chip with proven reliability and per-
formance.
• One x16 PCI Express Gen2 ports each supporting up to 8 GB/s direc-
tion peak bandwidth
• Compliant with PCI Rev 2.3 interface at 33 MHz
• One PCI Express x4 slot compliant with PCI Express Base Specification
revision 2.0
• Support PCI Express x1 slot
• Integrated SATA 3.0 Gb/s Host Controller
• Fourteen USB 2.0 ports supported
• Serial Peripheral Interface (SPI) support
• Enhanced DMA Controller, interrupt controller, and timer functions
• Integrated Graphics Support with PAVP 1.5
• Intel ® High Definition Audio Controller