ECS H55H-CM, Руководство пользователя, Страница: 6 / 74

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Introducing the Motherboard
Feature
• Accommodates Intel
®
Core
TM
i7/Core
TM
i5/Core
TM
i3 processors
• Supports “Hyper-Threading” technology CPU
“Hyper-Threading” technology enables the operating system into thinking
it’s hooked up to two processors, allowing two threads to be run in parallel, both
on separate “logical” processors within the same physical processor.
The motherboard uses an LGA1156 type of socket that carries the following
features:
Processor
Chipset
• Supports DDR3 1333/1066 DDR3 SDRAM with Dual-channel architec-
ture
• Accommodates four unbuffered DIMMs
• Up to 4 GB per DIMM with maximum memory size up to 16 GB
• Supports 1 Gb, 2 Gb and 4 Gb DDR3 DRAM technologies for x8 and x16
devices (It is not recommended to use 512 Mb DDR3 memory device on
this motherboard)
Memory
Audio (optional)
• 5.1 Channel High Definition Audio Codec
• ADCs support 44.1k/48k/96kHz sample rate
• Meets Microsoft WLP 3.10 Vista premium and mobile PCs audio
requirements
• Direct Sound 3D
TM
compatible
• 5.1Channel High Definition Audio Codec
• Exceeds Microsoft Windows Logo Program (WLP) Requirements
• ADCs support 44.1K/48K/96K/192KHz sample rate
• Power Support: Digital: 3.3V; Analog: 5.0V
• 7.1 + 2 channel High Definition Audio Codec
• All DACs Support 192k/96k/48k/44.1kHz DAC sample rate
• High –quality analog differential CD input
• Meets Microsoft WHQL/WLP 3.0 audio requirements
• Direct Sound 3D TM compatible
The Intel H55 Express Chipset is a single-chip with proven reliability and per-
formance.
• One x16 PCI Express Gen2 ports each supporting up to 8 GB/s direc-
tion peak bandwidth
• Compliant with PCI Rev 2.3 interface at 33 MHz
• Integrated SATA 3.0 Gb/s Host Controller
• Twelve USB 2.0 ports supported
• Serial Peripheral Interface (SPI) support
• Enhanced DMA Controller, interrupt controller, and timer functions
• Integrated Graphics Support with PAVP 1.5
This board supports CPU up to 95W TDP only.