Ebyte E70-915T30S, Руководство пользователя

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Chengdu Ebyte Electronic Technology Co,;Ltd E70-915T30S user manual
Copyright ©2012–2019 ， Chengdu Ebyte Electronic Technology Co,;Ltd 23
Key word Notes
Input program
The module is SOC with GPIO port. For program downloading, please use the special downloader of CC series:
JTAG (or the original CC1310 board from TI), any other serial port or ISP, ICP are unavailable to download. Below
is the connection diagram of JTAG
（
XDS100
）
. See more details in TI official document.
（
TDI and TDO pin can
be unconnected
）
Connection diagram of JTAG downloader
10. Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and
the module needs to be reliably grounded.
；

Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module
；

Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged
；

Please check the stability of the power supply, the voltage can not be fluctuated frequently
；

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation.
；

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference.
；

High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module.
If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is
spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module
and routed in the Bottom Layer
；

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees
；

It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect
the performance. It is recommended to keep them away from the module according to the strength of the interference.
If necessary, appropriate isolation and shielding can be done
；

Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,
power traces) around the module that will greatly affect the performance of the module. It is recommended to stay