Chengdu Ebyte Electronic Technology Co,;Ltd
E70-868T30S user
manual
Copyright
©2012–2019
,
Chengdu
Ebyte
Electronic
Technology
Co,;Ltd
29
12.2 Reflow soldering curve
13. E70 Series
Model No.
Core IC
Frequenc
y
Hz
Tx
power
dBm
Distance
km
Data Rate
Package
Size
mm
Interface
-
433M
30
6.5
2.5k~168k
DIP
24 * 38.5
IPEX/Stamp hole
-
433M
14
2.5
2.5k~168k
DIP
16 * 26
IPEX/Stamp hole
CC1310
915M
14
1.5
2.5k~168k
DIP
14 * 20
IPEX/Stamp hole
CC1310
433M
14
1.5
2.5k~168k
DIP
14 * 20
IPEX/Stamp hole
CC1310
915M
14
1.5
2.5k~168k
DIP
16 * 26
IPEX/Stamp hole
CC1310
868M
14
1.5
2.5k~168k
DIP
16 * 26
IPEX/Stamp hole
CC1310
915M
30
6
2.5k~168k
DIP
24 * 38.5
IPEX/Stamp hole
CC1310
868M
30
6
2.5k~168k
DIP
24 * 38.5
IPEX/Stamp hole
CC1310
433M
30
6
2.5k~168k
DIP
24 * 38.5
IPEX/Stamp hole
CC1310
433M
14
1.5
2.5k~168k
DIP
16 * 26
IPEX/Stamp hole