Chengdu Ebyte Electronic Technology Co,;Ltd
E32-400T20S User Manual
Copyright ©2012–2019
，
Chengdu Ebyte Electronic Technology Co,;Ltd
15
time (wireless wake-up). Only the data
from transmitter that works in mode 1
can be received.
1
1
1
2000ms
2
FEC switch
After turn off FEC, the actual data
transmission rate increases while
anti-interference ability decreases. Also
the transmission distance is relatively
short.
Both communication parties must keep
on the same pages about turn-on or
turn-off FEC.
0
Turn off FEC(default)
1
Turn on FEC
1
0
Transmission power (approximation)
The external power must make sure the
ability of current output more than 250mA
and ensure the power supply ripple within
100mV.
Low power transmission is not
recommended due to its low power supply
efficiency.
0
0
20dBm (default)
0
1
17dBm
1
0
14dBm
1
1
10dBm
For example: The meaning of No.3 "SPED" byte:
The binary bit of the byte
7
6
5
4
3
2
1
0
Configures by user
0
0
0
1
1
0
1
0
Meaning
UART parity bit 8N1
UART baud rate is 9600
Air data rate is 2.4k
Corresponding hexadecimal
1
A
8. Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and
the module needs to be reliably grounded.
；
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module
；
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged
；
Please check the stability of the power supply, the voltage can not be fluctuated frequently
；
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation.
；
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference.
；
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the
module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the
copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of
