Chengdu Ebyte Electronic Technology Co.,Ltd. E31-433T17D User Manual
Copyright ©2012–2019
，
Chengdu Ebyte Electronic Technology Co.,Ltd.
14
the communication must be turned on or
off.
1
0
Transmitting power (Approximate value)
The external power supply must provide
more than 200mA current output
capability. And ensure that the power
supply ripple is less than 100mV.
It is not recommended to use smaller
power transmission because of its low
power utilization efficiency.
0
0
17dBm
（
default
）
0
1
14dBm
1
0
10dBm
1
1
7dBm
For example
（
The meaning of the No. 3 "SPED" byte
）：
The binary digit of the byte
7
6
5
4
3
2
1
0
Specific value
（
Users configure
）
0
0
0
1
1
0
1
0
M eaning
Serial parity bit
8N1
Serial port baud rate 9600
Air data rate 2.4k
Corresponding hexadecimal
1
A
8 Hardware design
It is recommended to use a DC regulated power supply to supply power to the module. The power supply ripple
factor should be as small as possible, and the module needs to be reliably grounded.
Please pay attention to the correct connection of the positive and negative poles of the power supply. If the reverse
connection is made, the module may be permanently damaged.
Please check the power supply to ensure that it’s within the recommended power supply, or the module will be
permanently damaged if it exceeds the maximu m value.
Please check the stability of the power supply, and the voltage cannot be fluctuated frequently;
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, which is beneficial for long-term stable operation of the whole machine
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference;
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the
module. If it is necessary to pass the module, it is assumed that the module is soldered to the Top Layer, and the
copper is applied to the Top Layer of the module contact part(Copper is well grounded), and must be close to th e
digital part of the module and routed in the Bottom Layer;
Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom
Layer or other layers, which will affect the spurs and receiving sensitivity of the module in varying degrees;
Assume that there are devices with large electromagnetic interference around the module that will greatly affect the
performance of the module. It is recommended to keep away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done.
Assume that there are traces with large electromagnetic interference around the module (high -frequency digital,
high-frequency analog, power trace), which will greatly affect the performance of the module. It is recommended to
stay away from the module according to the strength of the interference. If possible, users can do some proper
isolation and shielding;
If the communication line uses 5V level, it must be connected in series with 1k-5.1k resistor (not recommended,
