Chengdu Ebyte Electronic Technology Co.,Ltd
E31-400M17S User Manual
Copyright ©2012–2019
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Chengdu Ebyte Electronic Technology Co.,Ltd
9
7 Soldering Guidance
7.1 Reflow Soldering Temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time(tL)Maintained Above(TL)
Time below liquid phase
line
60-90 sec
30-90 sec
Peak temperature(Tp)
Peak temp.
220-235℃
230-250℃
Average ramp-down rate(Tp to Tsmax)
Average ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature
for 25℃
6 minutes max
8 minutes max
7.2 Reflow soldering curve
