Chengdu Ebyte Electronic Technology Co., Ltd.
User Manual
Copyright ©2012–2021
，
Chengdu Ebyte Electronic Technology Co., Ltd.
10
Chapter 7 Welding Operation Guidance
7.1 Reflow temperature
Profile Feature
Curve feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Minimum preheat
temperature
100℃
150℃
Preheat temperature max (Tsmax)
Maximum preheat
temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheat time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rate of ascent
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquidus temperature
183℃
217℃
Time（tL）Maintained Above（TL）
Time above liquidus
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temperature
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average rate of descent
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time from 25°C to peak
temperature
6 minutes max
8 minutes max
