Ebyte E19-433M30S, Руководство пользователя

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Chengdu Ebyte Electronic Technology Co., Ltd. E19-433M30S User Manual
Copyright ©2012–2018
，
Chengdu Ebyte Electronic Technology Co.,Ltd. 7
6.FAQ
6.1 Communication range is too short
 The communication distance will be affected when obstacle exists.
 Data lose rate will be affected by temperature, humidity and co-channel interference.
 The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
 Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
 The signal will be affected when the antenna is near metal object or put in a metal case.
 Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).

The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power.
 Due to antenna quality or poor matching between antenna and module.
6.2 Module is easy to damage
 Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
 Please check the stability of power source, the voltage cannot fluctuate too much.
 Please make sure antistatic measure are taken when installing and using, high frequency devices have electrosta tic
susceptibility.
 Please ensure the humidity is within limited range, some parts are sensitive to humidity.
 Please avoid using modules under too high or too low temperature.
6.3 BER(Bit Error Rate) is high
 There are co-channel signal interference nearby, please be away from interference sources or modify frequency a nd
channel to avoid interference;

Poor power supply may cause messy code. Make sure that the power supply is reliable.
 The extension line and feeder quality are poor or too long, so the bit error rate is high;
7.Production guidance
7.1 Reflow soldering temperature
Profile Feature Curve characteristics Sn-Pb Assembly Pb-Free Assembly
Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Min preheating temp.
100℃ 150℃
Preheat temperature max (Tsmax) Mx preheating temp.
150℃ 200℃
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average ramp-up rate
3℃/second max 3℃/second max
Liquidous Temperature (TL) Liquid phase temp.
183℃ 217℃
Time
（
tL
）
Maintained Above
（
TL
）
Time below liquid phase line 60-90 sec 30-90 sec
Peak temperature
（
Tp
）
Peak temp. 220-235℃ 230-250℃