Ebyte E107-SC01 Series, Руководство пользователя

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Chengdu Ebyte Electronic Technology Co., Ltd E107-SC01User manual
Copyright ©2012–2019
，成都亿佰特电子科技有限公司
7-9
E107-SC01-G C301071001
（
HEX
）
Module restart
Command header
3 bytes C4C4C4H
No reply
Data transmission
Only supported by E107-SC01-N
Command
header
< Fixed head
Data 1
～
22 bytes valid data
No reply
Data reception
Only E107-SC01-G support
Length 08H
～
1DH
Length (including RSSI + MAC +
data)
RSSI 00H
～
FFH RSSI strength
MAC 6 bytes
（
HEX
）
Sender MAC address
Data 1
～
22 bytes
（
HEX
）
valid data
7.
Hardware Design

It is recommended to use DC stabilized power supply to supply power to the module. The power supply ripple
coefficient is as small as possible, and the module needs to be reliably grounded.

Please pay attention to the correct connection of the positive and negative poles of the power supply. If the reverse
connection is connected, the module may be permanently damaged.

Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,
the module will be permanently damaged.

Please check the stability of the power supply, the voltage can not be significantly frequent.

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, and the whole machine is beneficial for long-term stable operation.

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference.

High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If
it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is
spread on the Top Layer of the module contact part(All copper-covered and well grounded), and must be close to
the digital part of the module and routed in the Bottom Layer.

Assuming the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or
other layers, which will affect the module's spurs and receiving sensitivity to varying degrees.

Assuming that there are devices with large electromagnetic interference around the module, the performance of the