Ebyte E104-BT30, Руководство пользователя

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Chengdu Ebyte Electronic Technology Co.,Ltd E104-BT30 User Manual
Copyright ©2012–2019
，
Chengdu Ebyte Electronic Technology Co.,Ltd
6-9
lead to a permanent damage to the module.

Please check the stability of power supply and ensure the voltage not to fluctuate too much.

Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic
susceptibility.

Please ensure the humidity is within limited range for some parts are sensitive to humidity.

Please avoid using modules under too high or too low temperature.
6. Welding guidance
6.1 Reflow Soldering Temperature
Profile Feature Curve feature Sn-Pb Assembly Pb-Free Assembly
Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Minimum preheating
temperature
100
℃
150
℃
Preheat temperature max (Tsmax)
Maximum preheating
temperature
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average rising rate 3
℃
/second max 3
℃
/second max
Liquidous Temperature (TL) Liquid phase temperature 183
℃
217
℃
Time
（
tL
）
Maintained Above
（
TL
）
Time above liquidus 60-90 sec 30-90 sec
Peak temperature
（
Tp
）
Peak temperature 220-235
℃
230-250
℃
Aveage ramp-down rate
（
Tp to Tsmax
）
Average descent rate 6
℃
/second max 6
℃
/second max
Time 25
℃
to peak temperature
Time of 25 ° C to peak
temperature
6 minutes max 8 minutes max