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SI4463 wireless module
E10 series user manual
Copyright ©2012–2017,Chengdu Ebyte Electronic Technology Co.,Ltd.
12
5. Production Guidance
5.1. Reflow Soldering Temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)
100℃
150℃
Preheat temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3℃/second max
3℃/second max
Liquidous Temperature (TL)
183℃
217℃
Time(tL)Maintained Above(TL)
60-90 sec
30-90 sec
Peak temperature(Tp)
220-235℃
230-250℃
Aveage ramp-down rate(Tp to Tsmax)
6℃/second max
6℃/second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max
5.2. Reflow Curving Diagram