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，
Chengdu Ebyte Electronic Technology Co.,Ltd.
7
Chengdu Ebyte Electronic Technology Co. , Ltd.
6.2 Module is easy to damage
Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
Please check the stability of power source, the voltage cannot fluctuate too much.
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
The extension line and feeder quality are poor or too long, so the bit error rate is high;
7.Soldering guidance
7. 1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn- Pb Assembly
Pb- Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
(
Tsmin
)
Min preheating temp.
100℃
150℃
Preheat temperature max ( Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60- 120 sec
60- 120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp- up rate
3℃/second max
3℃/second max
Liquidous Temperature ( TL)
Liquid phase temp.
183℃
217℃
Time
(
tL
)
Maintained Above
(
TL
)
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature
(
Tp
)
Peak temp.
220-235℃
230-250℃
Aveage ramp-down rate
(
Tp to Tsmax
)
Average ramp- down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature for 25℃
6 minutes max
8 minutes max
E01-ML01IPX
User Manual
