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Chengdu Ebyte Electronic Technology Co., Ltd

E01C-ML01D User Manual

5

4.Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and the

module needs to be reliably grounded

Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse connection

may cause permanent damage to the module

Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the maximum

value the module will be permanently damaged;

Please check the stability of the power supply, the voltage can not be fluctuated frequently

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin,

so the whole machine is beneficial for long-term stable operation;

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts

with large electromagnetic interference;

High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it

is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on

the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module and routed in

the Bottom Layer

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or

other layers, which will affect the module's spurs and receiving sensitivity to varying degrees

It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the

performance. It is recommended to keep them away from the module according to the strength of the interference. If

necessary, appropriate isolation and shielding can be done

Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power

traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the

module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done.

If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a

risk of damage)

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0

The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure that

the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna

extension cable to extend the antenna to the outside

The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened.

Conductors or other sources of interference should be avoided around the onboard PCB antenna.

4.2 Software editing

Insert the module into the user circuit board, use the microcontroller to communicate with the module by SPI or serial port,

and operate the control register and the transceiver buffer through the SPI command to complete the wireless data transmit

and receive function.

As interrupt pin for IRQ, it can be used to wake-up MCU and achieve fast response; But the user can get the interrupt

status through SPI (not recommended, it is not conducive to the overall power consumption, and with low efficiency

);

CE pin can be high level for long-term, but it needs to set as POWER DOWN mode when the module writes registers, and

it is recommended that CE is controlled by MCU pin

Содержание E01-ML01D

Страница 1: ...E01C ML01D User Manual Si24R1 2 4GHz SPI DIP Wireless Module ...

Страница 2: ...3 2 2 Operating parameter 3 3 Size and pin definition 4 4 Basic operation 5 4 1 Hardware design 5 4 2 Software editing 5 5 Circuit diagram 6 6 FAQ 6 6 1 Communication range is too short 6 6 2 Module is easy to damage 6 6 3 BER Bit Error Rate is high 6 7 Soldering guidance 7 7 1 Reflow soldering temperature 7 7 2 Reflow soldering curve 7 8 Packing method for bulk order 8 Revision history 8 About us...

Страница 3: ...s multi level adjustable Global license free ISM 2 4GHz frequency band 2Mbps 1Mbps and 250kbps air rate 125 communication channels to meet application requirements such as multipoint communication grouping and frequency hopping Connect with MCU through SPI interface the rate is 0 10Mbps 2 0 3 6V power supply power supply greater than 3 3V can guarantee the best performance Industrial standard desi...

Страница 4: ...may be at risk of burning down Operating temperature 40 85 Industrial design Operating frequency MHz 2 4 2 525 Support ISM band Power consumption Tx current 12 0dBm Rx current 15 Sleep current 0 7 Software is shut down Max Tx power dBm 7 Receiving sensitivity dBm 83 Air data rate is 2Mbps Air data rate bps 250k 2M Controlled via user s programming Main parameter Description Remark Distance for ref...

Страница 5: ...tion Pin No Pin item Pin direction Pin application 1 GND Ground 2 VCC Power supply must be 2 0 3 6V 3 CE Input Chip Enable 4 CSN Input SPI Chip select 5 SCK Input SPI clock 6 MOSI Input SPI master output slave input 7 MISO Output SPI master input slave output 8 IRQ Output Interrupt request ...

Страница 6: ...mance It is recommended to keep them away from the module according to the strength of the interference If necessary appropriate isolation and shielding can be done Assume that there are traces with large electromagnetic interference high frequency digital high frequency analog power traces around the module that will greatly affect the performance of the module It is recommended to stay away from...

Страница 7: ... than 2 5V the lower the voltage the lower the transmitting power Due to antenna quality or poor matching between antenna and module 6 2 Module is easy to damage Please check the power supply source ensure it is 2 0V 3 6V voltage higher than 3 6V will damage the module Please check the stability of power source the voltage cannot fluctuate too much Please make sure antistatic measure are taken whe...

Страница 8: ...heating temp 150 200 Preheat Time Tsmin to Tsmax ts Preheating time 60 120 sec 60 120 sec Average ramp up rate Tsmax to Tp Average ramp up rate 3 second max 3 second max Liquidous Temperature TL Liquid phase temp 183 217 Time tL Maintained Above TL Time below liquid phase line 60 90 sec 30 90 sec Peak temperature Tp Peak temp 220 235 230 250 Aveage ramp down rate Tp to Tsmax Average ramp down rate...

Страница 9: ...ginal version Ren 1 1 2020 06 29 Format updated Ren About us Technical support support cdebyte com Documents and RF Setting download link www ebyte com Thank you for using Ebyte products Please contact us with any questions or suggestions info cdebyte com Official hotline 028 61399028 Web www ebyte com Address B5 Mould Park 199 Xiqu Ave High tech District Sichuan China ...

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