DMC TSC-40/IC, Технические характеристики, Страница: 17 / 24

Document No. DER-S0063A 16 Version 1.3 ©2011 DMC Co., Ltd.
TSC-40/IC Product Specification
80 to 150
°
C (Package surface temperature)
260
°
C max.
10s max. (P Secondary flow
passage duration)
Time
Te
mpe
rature
110
±
30s
175
±
15
°
C
1 to 4
°
C/s
220
°
C or above, 60s max.
255
°
C or above, 10-16s max.
260
°
C max.
Time
Package’
s surface
temperat
u
re
8. Implementation Temperature Specification
1. Reflow method (Infrared reflow, air reflow)
Frequency: Three times or less
Temperature: The following device surface temperature profile is recommended.
Figure 1: Infrared reflow, air reflow temperature profile
2. Wave soldering method (Flow soldering, solder dip method)
Frequency: One time or less
Temperature: Following temperature profile is recommended (Set the optimal preheat temperature
according to the flux type)
Figure 2: Wave soldering temperature profile
3. Soldering iron (Manual soldering)
Soldering bit’s temperature: 370
°
C or lower
Soldering time: Five seconds or less/terminal