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Contents
1. Specifications.
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1-1. Description.
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1-2. Features.
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1-3. STRUCTURE AND PRINCIPLE OPERATION OF LCD.
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1-4. General Specification.
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1-4-1. Specification.
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1-4-2. I/O Description.
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1-5. Operation Environmental Conditions.
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1-6. Storage Environmental Conditions.
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1-7. Mechanical Test Conditions.
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2. Block Diagram.
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2-1. Panel Block Diagram.
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2-2. Connector Layout & Pin Assignment.
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2-2-1 PAL & SECAM – SCART.
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3. Board Assembling.
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3-1. Preparation.
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3-2. Board Assembly Diagram
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3-2-1 Harness Path Diagram. (PAL/SECAM).
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3- 3. Board Sort.
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3-3-1 How to sort Main PCB according to Panel Maker (LG or Samsung).
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3-3-2 How to sort Tuner PCB according to System (PAL, ATSC, 3-System).
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4. Set Assembly.
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4-1. Assembly Diagram.
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4-1-1. Assemblage of Front Parts.
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4-1-2. Assemblage of IR.
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4-1-3. Sub Panel Assembly.
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