Denon HEOS Amp, Руководство по обслуживанию

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ABOUT THIS MANUAL .............................................................3
What you can do with this manual ............................................3
Using Adobe Reader (Windows version) ..................................4
SAFETY PRECAUTIONS ..........................................................6
NOTE FOR SCHEMATIC DIAGRAM
.........................................7
NOTE FOR PARTS LIST ...........................................................7
TECHNICAL SPECIFICATIONS ................................................9
DIMENSION ...............................................................................9
DISASSEMBLY ........................................................................10
1. SIDE COVER AND SIDE KEY PCB ...................................12
2. TOP COVER / BOTTOM COVER ......................................13
3. CORE MODULE PCB ASSY .............................................14
4. DIGITAL PCB .....................................................................15
5. SUB SMPS PCB ................................................................16
6. MAIN (VOLUME-SMPS) PCB ...........................................17
7. FRONT PANEL ASSY ........................................................17
Procedure after Replacing the Microprocessor, etc. ..........18
Firmware Update Procedure ..................................................18
1. MAIN PCB Update Procedure ............................................18
2. Updating by USB ................................................................20
3. Service region settings update procedures ........................21
4. Service Release Type settings update procedures ............22
5. Firmware burning procedure after Core Module
replacement flow ....................................................................23
6. How to check the version , Release Type, Locale .............24
TROUBLE SHOOTING ............................................................25
1. POWER ..............................................................................25
2. AUDIO ................................................................................27
AUDIO CHECK PATH .............................................................29
MEASURING METHOD AND WAVEFORMS .........................33
BLOCK DIAGRAM
...................................................................36
POWER DIAGRAM ..................................................................37
WIRING DIAGRAM ..................................................................38
PRINTED Circuit BOARDS .....................................................39
SCHEMATIC DIAGRAMS .......................................................42
MAIN ......................................................................................42
DSP DIR USB .........................................................................43
DAMP ......................................................................................44
SMPS ......................................................................................45
FRONT ....................................................................................46
MAIN BT NFC KEY .................................................................47
TOUCH PAD ...........................................................................48
EXPLODED VIEW ...................................................................50
PACKING VIEW .......................................................................52
SEMICONDUCTORS ...............................................................53
1. IC's .....................................................................................53
CONTENTS
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