DS_DNM04SMD10_07162008
15
PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL
LEAD (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE
Time ( sec. )
Pre-heat temp.
140~180
°
C 60~120 sec.
Peak temp.
210~230
°
C 5sec.
Ramp-up temp.
0.5~3.0
°
C /sec.
Te
mper
atur
e (
°
C )
50
100
150
200
250
300
60
0 120
180
240
2nd Ramp-up temp.
1.0~3.0
°
C /sec.
Over 200
°
C
40~50sec.
Cooling down rate <3
°
C /sec.
LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE
Note: All temperature refers to assembly application board, measured on the land of assembly application board.
Temp
.
Time
150
℃
200
℃
90~120 sec.
Time Limited 75 sec.
above 220
℃
220
℃
Preheat time
Ramp up
max. 3
℃
/sec.
Ramp down
max. 4
℃
/sec.
Peak Temp. 240 ~ 245
℃
25
℃
