The system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset architectural
configuration. The following are the recommended guidelines for installing memory modules:
•
x4 and x8 DRAM based memory modules can be mixed. For more information, see the Mode-specific guidelines section.
•
Up to three dual- or single-rank RDIMMs can be populated per channel.
•
If memory modules with different speeds are installed, they will operate at the speed of the slowest installed memory module(s) or
slower depending on system DIMM configuration.
•
Populate memory module sockets only if a processor is installed. For single-processor systems, sockets A1 to A4 are available. For dual-
processor systems, sockets A1 to A4 and sockets B1 to B4 are available.
•
Populate all the sockets with white release tabs first, followed by the black release tabs, and then the green release tabs.
•
When mixing memory modules with different capacities, populate the sockets with memory modules with highest capacity first. For
example, if you want to mix 4 GB and 8 GB memory modules, populate 8 GB memory modules in the sockets with white release tabs
and 4 GB memory modules in the sockets with black release tabs.
•
In a dual-processor configuration, the memory configuration for each processor should be identical. For example, if you populate socket
A1 for processor 1, then populate socket B1 for processor 2, and so on.
•
Memory modules of different capacities can be mixed provided other memory population rules are followed (for example, 4 GB and 8
GB memory modules can be mixed).
•
The memory module for DIMM sockets A3, A4, B3, and B4 need to be inserted 180° reverse with regard to the DIMMs in the sockets
A1, A2, B1, and B2.
•
Mixing of more than two memory module capacities in a system is not supported.
•
Populate four memory modules per processor (one DIMM per channel) at a time to maximize performance.
Table 24. Heat sink—processor configurations
Processor configuration
Processor type (in
Watts)
Heat sink width
Number of DIMMs
Maximum system
capacity
Reliability, Availability,
and Serviceability (RAS)
features
Dual processor
Up to 120 W
61 mm
8
8
Single processor
140 W
96 mm
4
4
120 W
61 mm
4
4
Related links
Mode-specific guidelines
Four memory channels are allocated to each processor. The allowable configurations depend on the memory mode selected.
Advanced Error Correction Code (lockstep)
Advanced Error Correction Code (ECC) mode extends SDDC from x4 DRAM based DIMMs to both x4 and x8 DRAMs. This protects
against single DRAM chip failures during normal operation.
The installation guidelines for memory modules are as follows:
•
Memory modules must be identical in size, speed, and technology.
•
DIMMs installed in memory sockets with white release levers must be identical and the same rule applies for sockets with black release
levers. This ensures that identical DIMMs are installed in matched pair —for example, A1 with A2, A3 with A4, A5 with A6, and so on.
•
DIMMs installed in memory sockets with white release tabs must be identical and similar rule applies for sockets with black release
tabs. This ensures that identical DIMMs are installed in matched pairs- for example, A1 with A2, A3 with A4 and so on.
56
Installing and removing sled components
