3.
Installation and Use
© China Daheng Group, Inc. Beijing Image Vision Technology Branch 13
4) Heat dissipation of acquisition board
When the temperature around the acquisition board exceeds 45 degrees, it is recommended that the user
dissipate heat on the main chip. Heat conductive material is used to couple heat of the main chip to the
housing / radiator. The following is the heat conduction region of the imaging board with the heat
conductive material:
Figure 3-5: The heat conduction region of the imaging board with the heat conductive material
5) ESD electrostatic protection
During installation and debugging, the human body may discharge to the component on the PCB board,
resulting in permanent damage to the camera. Therefore, before exposure to the camera, wear an
antistatic bracelet. Or touch the metal rack first, and release the accumulated charge of the body.
3.2. Software Installation
In the Daheng Imaging Camera Software Suite, run Galaxy SDK installer to realize software installation.
The installation process is relatively simple, but you have to take attention to the following matters:
1) The path of installation can only be ASCII characters, otherwise you will not start the application
successfully.
2) When you are installing the setup suite, antivirus will ask you whether to allow some operations, then
you must allow these operations. In addition, in the process of uninstalling the installation package,
antivirus will also ask you whether to allow some operations, then you must allow these operations.
3) If you are using USB3.0 Vision Cameras in Windows XP, and you have installed the Daheng Imaging
Camera Software Suite without cameras connected to your PC, you must run Galaxy UpdateDriver
firstly.
The VEN-U3X series camera
can’t work in
USB2.0 mode. When the camera is connected to the
USB2.0 host interface or USB2.0 HUB, you will not open, control the camera and acquisition images.
