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Cypress EZ-BLE PRoC CYBLE-022001-00, Руководство пользователя

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Cypress EZ-BLE PRoC CYBLE-022001-00 Скачать руководство пользователя страница 31

CYBLE-022001-00

Document Number: 001-95662 Rev. *J

Page 31 of 40

MIC Japan

CYBLE-022001-00 is certified as a module with type certification number 005-101007. End products that integrate CYBLE-022001-00

do not need additional MIC Japan certification for the end product.
End product can display the certification label of the embedded module.

KC Korea

CYBLE-022001-00 is certified for use in Korea with certificate number MSIP-CRM-Cyp-2001.

 

Model

 

Name:

 

EZ

‐

BLE

 

PRoC

 

Module

 

Part

 

Number:

 

CYBLE

‐

022001

‐

00

 

Manufactured

 

by

 

Cypress

 

Semiconductor.

 

 

005

‐

101007

 

Содержание EZ-BLE PRoC CYBLE-022001-00

Страница 1: ...CRM Cyp 2001 Bluetooth SIG 4 1 qualified QDID 67366 Declaration ID D026297 Power Consumption TX output power 18 dbm to 3 dbm Received signal strength indicator RSSI with 1 dB resolution TX current co...

Страница 2: ...at enables concurrent hardware and firmware editing compiling and debugging of PSoC 3 PSoC 4 PSoC 5LP PSoC 4 BLE PRoC BLE and EZ BLE module systems with no code size limitations PSoC peripherals are d...

Страница 3: ...19 Serial Communication 21 Memory 22 System Resources 22 Environmental Specifications 28 Environmental Compliance 28 RF Certification 28 Safety Certification 28 Environmental Conditions 28 ESD and EM...

Страница 4: ...rea are maintained Designs should be held within the physical dimensions shown in the mechanical drawings in Figure 1 All dimensions are in millimeters mm Table 1 Module Design Dimensions See Figure 1...

Страница 5: ...ing Bottom View Seen from Bottom Side View Top View See from Top Note 1 No metal should be located beneath or above the antenna area Only bare PCB material should be located beneath the antenna area F...

Страница 6: ...corner This placement minimizes the additional recommended keep out area stated in item 2 Refer to AN96841 for module placement best practices 2 To maximize RF performance the area immediately around...

Страница 7: ...nless otherwise noted Pad length of 0 91 mm 0 455 mm from center of the pad on either side shown in Figure 6 is the minimum recommended host pad length The host PCB layout pattern can be completed usi...

Страница 8: ...sion from Orign mils 1 0 26 1 64 10 24 64 57 2 0 26 2 41 10 24 94 88 3 0 26 3 17 10 24 124 80 4 0 26 3 93 10 24 154 72 5 0 26 4 69 10 24 184 65 6 0 81 9 74 31 89 383 46 7 1 57 9 74 61 81 383 46 8 2 34...

Страница 9: ...B1_SDA TCPWM Sensor 17 P3 7 SCB1_CTS TCPWM Sensor 18 P1 4 SCB0_RX SCB0_MOSI SCB0_SDA TCPWM Sensor 19 P1 5 SCB0_TX SCB0_MISO SCB0_SCL TCPWM Sensor 20 P3 6 SCB1_RTS TCPWM Sensor 21 P4 0 6 SCB1_RTS SCB1_...

Страница 10: ...t VDD and VDDR to the same supply 2 Independent supply Power VDD and VDDR separately External Component Recommendation In either connection scenario it is recommended to place an external ferrite bead...

Страница 11: ...CYBLE 022001 00 Document Number 001 95662 Rev J Page 11 of 40 The CYBLE 022001 00 schematic is shown in Figure 9 Figure 9 CYBLE 022001 00 Schematic Diagram...

Страница 12: ...press module performance improves many of these characteristics For more information see Table 8 Table 6 Chip Antenna Specifications Component Reference Designator Description Silicon U1 68 pin WLCSP...

Страница 13: ...BS Maximum current per GPIO 25 25 mA Absolute maximum IGPIO_injection GPIO injection current Maximum for VIH VDD and minimum for VIL VSS 0 5 0 5 mA Absolute maximum current injected per pin LU Pin cur...

Страница 14: ...1 71 V to 1 89 V Regulator Bypassed IDD19 WDT with WCO on A T 25 C IDD20 WDT with WCO on A T 40 C to 85 C Hibernate Mode VDD 1 8 V to 3 6 V IDD27 GPIO and reset active 150 nA T 25 C VDD 3 3 V IDD28 GP...

Страница 15: ...V 2 0 V VIL Input voltage LOW threshold 0 3 VDD V CMOS input LVTTL input VDD 2 7 V 0 3 VDD V LVTTL input VDD 2 7 V 0 8 V VOH Output voltage HIGH level VDD 0 6 V IOH 4 mA at 3 3 V VDD Output voltage H...

Страница 16: ...25 pF load 60 40 duty cycle FGPIOIN GPIO input operating frequency 1 71 V VDD 5 5 V 48 MHz 90 10 VIO Table 13 OVT GPIO DC Specifications P5_0 and P5_1 Only Parameter Description Min Typ Max Units Det...

Страница 17: ...on Min Typ Max Units Details Conditions A_RES Resolution 12 bits A_CHNIS_S Number of channels single ended 6 6 full speed 9 A CHNKS_D Number of channels differential 3 Diff inputs use neighboring I O...

Страница 18: ..._dnl Differential nonlinearity VDD 1 71 V to 5 5 V 1 Msps 1 2 2 LSB VREF 1 V to VDD A_DNL Differential nonlinearity VDD 1 71 V to 3 6 V 1 Msps 1 2 LSB VREF 1 71 V to VDD A_DNL Differential nonlinearit...

Страница 19: ...IDEXT Enable pulse width external 2 TCLK ns TTIMRESWINT Reset pulse width internal 2 TCLK ns TTIMRESEXT Reset pulse width external 2 TCLK ns Table 22 Counter DC Specifications Parameter Description Mi...

Страница 20: ...PWMKILLEXT Kill pulse width external 2 TCLK ns TPWMEINT Enable pulse width internal 2 TCLK ns TPWMENEXT Enable pulse width external 2 TCLK ns TPWMRESWINT Reset pulse width internal 2 TCLK ns TPWMRESWE...

Страница 21: ...ion Min Typ Max Units Details Conditions ISPI1 Block current consumption at 1 Mbps 360 A ISPI2 Block current consumption at 4 Mbps 560 A ISPI3 Block current consumption at 8 Mbps 600 A Table 33 Fixed...

Страница 22: ...10 K P E cycles 10 years Table 38 POR DC Specifications Parameter Description Min Typ Max Units Details Conditions VRISEIPOR Rising trip voltage 0 80 1 45 V VFALLIPOR Falling trip voltage 0 75 1 40 V...

Страница 23: ...001b 2 54 2 60 2 67 V VLVI11 LVI_A D_SEL 3 0 1010b 2 63 2 70 2 77 V VLVI12 LVI_A D_SEL 3 0 1011b 2 73 2 80 2 87 V VLVI13 LVI_A D_SEL 3 0 1100b 2 83 2 90 2 97 V VLVI14 LVI_A D_SEL 3 0 1101b 2 93 3 00 3...

Страница 24: ...0 3 1 05 A Table 48 ILO AC Specifications Parameter Description Min Typ Max Units Details Conditions TSTARTILO1 ILO startup time 2 ms FILOTRIM1 32 kHz trimmed frequency 15 32 50 kHz Parameter Descrip...

Страница 25: ...2399 MHz 35 27 dBm RF PHY Specification RCV LE CA 04 C OBB3 Out of band blocking Wanted signal at 67 dBm and Interferer at F 2484 2997 MHz 35 27 dBm RF PHY Specification RCV LE CA 04 C OBB4 Out of ba...

Страница 26: ...ations IRX Receive current in normal mode 18 7 mA IRX_RF Radio receive current in normal mode 16 4 mA Measured at VDDR IRX HIGHGAIN Receive current in high gain mode 21 5 mA ITX 3dBm TX current at 3 d...

Страница 27: ...kbps IDLE2TX BLE IDLE to BLE TX transition time 120 140 s IDLE2RX BLE IDLE to BLE RX transition time 75 120 s RSSI Specifications RSSI ACC RSSI accuracy 5 dB RSSI RES RSSI resolution 1 dB RSSI PER RS...

Страница 28: ...le Table 51 Environmental Conditions for CYBLE 022001 00 ESD and EMI Protection Exposed components require special attention to ESD and electromagnetic interference EMI A grounded conductive layer ins...

Страница 29: ...tlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help LABELING REQUIREMENTS The Original Equipment Manufacturer OEM...

Страница 30: ...ns 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Le pr sent appareil est conforme aux...

Страница 31: ...at integrate CYBLE 022001 00 do not need additional MIC Japan certification for the end product End product can display the certification label of the embedded module KC Korea CYBLE 022001 00 is certi...

Страница 32: ...rientation of the CYBLE 022001 00 in the tape as well as the direction for unreeling Figure 11 Component Orientation in Tape and Unreeling Direction Table 52 Solder Reflow Peak Temperature Module Part...

Страница 33: ...dimensions used for the CYBLE 022001 00 Figure 12 Reel Dimensions The CYBLE 022001 00 is designed to be used with pick and place equipment in an SMT manufacturing environment The center of mass for t...

Страница 34: ...LE products contact your local Cypress sales representative To locate the nearest Cypress office visit our website Table 54 Ordering Information Part Number CPU Speed MHz Flash Size KB CapSense SCB TC...

Страница 35: ...integrated design environment KC Korea Certification MIC Ministry of Internal Affairs and Communications Japan PCB printed circuit board RX receive QDID qualification design ID SMT surface mount tech...

Страница 36: ...fied respectively in all instances across the document Updated Overview Updated Module Description Changed GPIO number from 12 to 16 Added QDID and Declaration ID under Bluetooth SIG 4 1 qualified ite...

Страница 37: ...o provide the location to the center of each solder pad from the origin in mm and mils Added Figure 6 to provide the location to the center of each solder pad from the origin in mm and mils Updated El...

Страница 38: ...Specification Updated System Resources Updated Internal Low Speed Oscillator Updated Table 49 Updated details in Value column corresponding to ECOTRIM parameter Updated Environmental Specifications Ad...

Страница 39: ...of 40 J 6002363 DSO 12 22 2017 Update reel dimensions in Figure 10 and Figure 12 Document History Page continued Document Title CYBLE 022001 00 EZ BLE PRoC Module Document Number 001 95662 Revision E...

Страница 40: ...ny liability arising out of the application or use of any product or circuit described in this document Any information provided in this document including any sample design information or programming...

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