background image

 

2-Mbit (128K x 16) Static RAM

CY62137EV30

MoBL

®

Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document #: 38-05443 Rev. *B

 Revised February 14, 2006

Features

• Very high speed: 45 ns

• Wide voltage range: 2.20V–3.60V

• Pin-compatible with CY62137CV30

• Ultra-low standby power

Typical standby current: 1

µ

A

Maximum standby current: 7

µ

A

 Ultra-low active power

— Typical active current: 2 mA @ f = 1 MHz

• Easy memory expansion with CE, and OE features

• Automatic power-down when deselected

• CMOS for optimum speed/power

• Byte power-down feature

• Offered in Pb-free 48-ball VFBGA and 44-pin TSOPII 

package

Functional Description

[1]

The CY62137EV30 is a high-performance CMOS static RAM
organized as 128K words by 16 bits. This device features ad-
vanced circuit design to provide ultra-low active current. This
is ideal for providing More Battery Life™ (MoBL

®

) in portable

applications such as cellular telephones. The device also has
an automatic power-down feature that significantly reduces
power consumption by 90% when addresses are not toggling.
The device can also be put into standby mode reducing power
consumption by more than 99% when deselected (CE HIGH
or both BLE and BHE are HIGH). The input/output pins (I/O

0

through I/O

15

) are placed in a high-impedance state when:

deselected (CE HIGH), outputs are disabled (OE HIGH), both
Byte High Enable and Byte Low Enable are disabled (BHE,
BLE HIGH), or during a write operation (CE LOW and WE
LOW).

Writing to the device is accomplished by asserting Chip En-
able (CE) and Write Enable (WE) inputs LOW. If Byte Low
Enable (BLE) is LOW, then data from I/O pins (I/O

0

 through

I/O

7

), is written into the location specified on the address pins

(A

0

 through A

16

). If Byte High Enable (BHE) is LOW, then data

from I/O pins (I/O

8

 through I/O

15

) is written into the location

specified on the address pins (A

0

 through A

16

).

Reading from the device is accomplished by asserting Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O

0

 to I/O

7

. If Byte High Enable (BHE) is

LOW, then data from memory will appear on I/O

8

 to I/O

15

. See

the truth table at the back of this data sheet for a complete
description of read and write modes.

The CY62137EV30 is available in 48-ball VFBGA and 44-pin
TSOPII packages. 

Note: 

1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.

Logic Block Diagram

128K x 16

RAM Array

I/O

0

 – I/O

7

ROW D

E

CODER

 

A

8

A

7

A

6

A

5

A

2

COLUMN DECODER

A

11

A

12

A

13

A

14

A

15

SENSE AMPS

DATA IN DRIVERS

OE

A

4

A

3

I/O

8

 – I/O

15

CE

WE

BHE

A

16

A

0

A

1

A

9

Power

-

Down

Circuit

BHE

BLE

CE

A

10

BLE

[+] Feedback 

Содержание CY62137EV30

Страница 1: ...edance state when deselected CE HIGH outputs are disabled OE HIGH both Byte High Enable and Byte Low Enable are disabled BHE BLE HIGH or during a write operation CE LOW and WE LOW Writing to the device is accomplished by asserting Chip En able CE and Write Enable WE inputs LOW If Byte Low Enable BLE is LOW then data from I O pins I O0 through I O7 is written into the location specified on the addr...

Страница 2: ... are address expansion pins for 4 Mb 8 Mb 16 Mb and 32 Mb respectively WE A11 A10 A6 A0 A3 CE I O10 I O8 I O9 A4 A5 I O11 I O13 I O12 I O14 I O15 VSS A9 A8 OE Vss A7 I O0 BHE NC NC A2 A1 BLE VCC I O2 I O1 I O3 I O4 I O5 I O6 I O7 A15 A14 A13 A12 NC NC NC 3 2 6 5 4 1 D E B A C F G H A16 NC Vcc WE 1 2 3 4 5 6 7 8 9 10 11 14 31 32 36 35 34 33 37 40 39 38 12 13 41 44 43 42 16 15 29 30 VCC A16 A15 A14 ...

Страница 3: ...OL 0 1 mA VCC 2 20V 0 4 V IOL 2 1mA VCC 2 70V 0 4 V VIH Input HIGH Voltage VCC 2 2V to 2 7V 1 8 VCC 0 3 V VCC 2 7V to 3 6V 2 2 VCC 0 3 V VIL Input LOW Voltage VCC 2 2V to 2 7V 0 3 0 6 V VCC 2 7V to 3 6V 0 3 0 8 V IIX Input Leakage Current GND VI VCC 1 1 µA IOZ Output Leakage Current GND VO VCC Output Disabled 1 1 µA ICC VCC Operating Supply Current f fMAX 1 tRC VCC VCCmax IOUT 0 mA CMOS levels 15 ...

Страница 4: ... V Data Retention Characteristics Over the Operating Range Parameter Description Conditions Min Typ 7 Max Unit VDR VCC for Data Retention 1 V ICCDR Data Retention Current VCC 1V CE VCC 0 2V VIN VCC 0 2V or VIN 0 2V 0 8 3 µA tCDR 8 Chip Deselect to Data Retention Time 0 ns tR 9 Operation Recovery Time tRC ns VCC VCC OUTPUT R2 30 pF INCLUDING JIG AND SCOPE GND 90 10 90 10 Rise Time 1 V ns Fall Time ...

Страница 5: ... Write End 0 ns tHZWE WE LOW to High Z 12 13 18 ns tLZWE WE HIGH to Low Z 12 10 ns Notes 10 BHE BLE is the AND of both BHE and BLE The chip can be deselected by either disabling the chip enable signals or by disabling both BHE and BLE 11 Test conditions for all parameters other than tri state parameters assume signal transition time of 3 ns 1V ns or less timing reference levels of VCC typ 2 input ...

Страница 6: ...inuously selected OE CE VIL BHE and or BLE VIL 16 WE is HIGH for read cycle 17 Address valid prior to or coincident with CE and BHE BLE transition LOW ADDRESS DATA OUT PREVIOUS DATA VALID DATA VALID tRC tAA tOHA 50 50 DATA VALID tRC tACE tLZBE tLZCE tPU DATA OUT HIGH IMPEDANCE IMPEDANCE ICC ISB tHZOE tHZCE tPD OE CE HIGH VCC SUPPLY CURRENT tHZBE BHE BLE tLZOE ADDRESS tDBE tDOE Feedback ...

Страница 7: ...s HIGH simultaneously with WE VIH the output remains in a high impedance state 20 During this period the I Os are in output state and input signals should not be applied Switching Waveforms continued tHD tSD tPWE tSA tHA tAW tWC DATA I O ADDRESS CE WE OE tHZOE DATAIN NOTE20 BHE BLE tBW tSCE tHD tSD tPWE tHA tAW tSCE tWC tHZOE DATAIN CE ADDRESS WE DATA I O OE NOTE 20 BHE BLE tBW tSA Feedback ...

Страница 8: ... OE LOW 19 Write Cycle No 4 BHE BLE Controlled OE LOW 19 Switching Waveforms continued DATAIN tHD tSD tLZWE tPWE tSA tHA tAW tSCE tWC tHZWE CE ADDRESS WE DATAI O NOTE 20 tBW BHE BLE DATA I O ADDRESS tSD tSA tHA tAW tWC CE WE DATAIN NOTE 20 tBW BHE BLE tSCE tPWE tHZWE tHD tLZWE Feedback ...

Страница 9: ...ead Active ICC L H H L L High Z Output Disabled Active ICC L H H H L High Z Output Disabled Active ICC L H H L H High Z Output Disabled Active ICC L L X L L Data In I OO I O15 Write Active ICC L L X H L Data In I OO I O7 I O8 I O15 in High Z Write Active ICC L L X L H Data In I O8 I O15 I O0 I O7 in High Z Write Active ICC Ordering Information Speed ns Ordering Code Package Diagram Package Type Op...

Страница 10: ...8X Ø0 25 M C A B Ø0 05 M C B A 0 15 4X 0 21 0 05 1 00 MAX C SEATING PLANE 0 55 MAX 0 25 C 0 10 C A1 CORNER TOP VIEW BOTTOM VIEW 2 3 4 3 75 5 25 B C D E F G H 6 5 4 6 5 2 3 1 D H F G E C B A 6 00 0 10 8 00 0 10 A 8 00 0 10 6 00 0 10 B 1 875 2 625 0 26 MAX 48 pin VFBGA 6 x 8 x 1 mm 51 85150 51 85150 D Feedback ...

Страница 11: ...ursuant to an express written agreement with Cypress Furthermore Cypress does not authorize its products for use as critical components in life support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user The inclusion of Cypress products in life support systems application implies that the manufacturer assumes all risk of such use and in do...

Страница 12: ... L version Changed ball E3 from DNU to NC Removed the redundant footnote on DNU Moved Product Portfolio from Page 3 to Page 2 Changed ICC Max value from 2 mA to 2 5 mA and ICC Typ value from 1 5 mA to 2 mA at f 1 MHz Changed ICC Typ value from 12 mA to 15 mA at f fmax 1 tRC Changed ISB1 and ISB2 Typ values from 0 7 µA to 1 µA and Max values from 2 5 µA to 7 µA Changed VCC stabilization time in foo...

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