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CY7C1471BV33

CY7C1473BV33, CY7C1475BV33

Document #: 001-15029 Rev. *B

Page 9 of 32

Functional Overview

The CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33
are synchronous flow through burst SRAMs designed
specifically to eliminate wait states during write-read transitions.
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. The clock signal is qualified with the
Clock Enable input signal (CEN). If CEN is HIGH, the clock signal
is not recognized and all internal states are maintained. All
synchronous operations are qualified with CEN. Maximum
access delay from the clock rise (t

CDV

) is 6.5 ns (133 MHz

device).

Accesses may be initiated by asserting all three Chip Enables
(CE

1

, CE

2

, CE

3

) active at the rising edge of the clock. If (CEN)

is active LOW and ADV/LD is asserted LOW, the address
presented to the device is latched. The access can either be a
read or write operation, depending on the status of the Write
Enable (WE). Byte Write Select (BW

X

) can be used to conduct

Byte Write operations. 

Write operations are qualified by the Write Enable (WE). All
writes are simplified with on-chip synchronous self timed write
circuitry. 

Three synchronous Chip Enables (CE

1

, CE

2

, CE

3

) and an

asynchronous Output Enable (OE) simplify depth expansion. All
operations (reads, writes, and deselects) are pipelined. ADV/LD
must be driven LOW after the device is deselected to load a new
address for the next operation.

Single Read Accesses

A read access is initiated when these conditions are satisfied at
clock rise: 

CEN is asserted LOW

CE

1

, CE

2

, and CE

are ALL asserted active

WE is deasserted HIGH

ADV/LD is asserted LOW 

The address presented to the address inputs is latched into the
Address Register and presented to the memory array and control
logic. The control logic determines that a read access is in
progress and allows the requested data to propagate to the
output buffers. The data is available within 6.5 ns (133 MHz
device) provided OE is active LOW. After the first clock of the
read access, the output buffers are controlled by OE and the
internal control logic. OE must be driven LOW to drive out the
requested data. On the subsequent clock, another operation
(read/write/deselect) can be initiated. When the SRAM is
deselected at clock rise by one of the chip enable signals, output
is tri-stated immediately.

Burst Read Accesses

The CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33
have an on-chip burst counter that enables the user to supply a
single address and conduct up to four reads without reasserting
the address inputs. ADV/LD must be driven LOW to load a new
address into the SRAM, as described in the Single Read Access
section. The sequence of the burst counter is determined by the
MODE input signal. A LOW input on MODE selects a linear burst
mode, a HIGH selects an interleaved burst sequence. Both burst
counters use A0 and A1 in the burst sequence, and wrap around
when incremented sufficiently. A HIGH input on ADV/LD
increments the internal burst counter regardless of the state of
chip enable inputs or WE. WE is latched at the beginning of a
burst cycle. Therefore, the type of access (read or write) is
maintained throughout the burst sequence.

TDO

JTAG serial 

output

Synchronous

Serial Data-Out to the JTAG Circuit

. Delivers data on the negative edge of TCK. If the JTAG 

feature is not used, this pin must be left unconnected. This pin is not available on TQFP 
packages.

TDI

JTAG serial input

Synchronous

Serial Data-In to the JTAG Circuit

. Sampled on the rising edge of TCK. If the JTAG feature is 

not used, this pin can be left floating or connected to V

DD 

through a pull up resistor. This pin is 

not available on TQFP packages.

TMS

JTAG serial input

Synchronous

Serial Data-In to the JTAG Circuit

. Sampled on the rising edge of TCK. If the JTAG feature is 

not used, this pin can be disconnected or connected to V

DD

. This pin is not available on TQFP 

packages.

TCK

JTAG

-Clock

Clock Input to the JTAG Circuitry

. If the JTAG feature is not used, this pin must be connected 

to V

SS

. This pin is not available on TQFP packages.

NC

-

No Connects

. Not internally connected to the die. 144M, 288M, 576M, and 1G are address 

expansion pins and are not internally connected to the die.

Pin Definitions

 (continued)

Name

IO

Description

[+] Feedback 

Содержание CY7C1471BV33

Страница 1: ...V 2M x 36 4M x 18 1M x 72 synchronous flow through burst SRAMs designed specifically to support unlimited true back to back read or write operations without the insertion of wait states The CY7C1471BV...

Страница 2: ...OGIC A0 A1 D1 D0 Q1 Q0 A0 A1 ADV LD CE ADV LD C CLK CEN WRITE DRIVERS D A T A S T E E R I N G S E N S E A M P S WRITE ADDRESS REGISTER A0 A1 A O U T P U T B U F F E R S E ZZ SLEEP CONTROL C MODE BWA B...

Страница 3: ...D A T A S T E E R I N G O U T P U T B U F F E R S MEMORY ARRAY E E INPUT REGISTER 0 ADDRESS REGISTER 0 WRITE ADDRESS REGISTER 1 BURST LOGIC A0 A1 D1 D0 Q1 Q0 A0 A1 C ADV LD ADV LD E INPUT REGISTER 1 S...

Страница 4: ...DD NC VSS DQD DQD VDDQ VSS DQD DQD DQD DQD VSS VDDQ DQD DQD DQPD A A CE 1 CE 2 BW D BW C BW B BW A CE 3 V DD V SS CLK WE CEN OE A A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26...

Страница 5: ...QB NC VDD NC VSS DQB DQB VDDQ VSS DQB DQB DQPB NC VSS VDDQ NC NC NC A A CE 1 CE 2 NC NC BW B BW A CE 3 V DD V SS CLK WE CEN OE A A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26...

Страница 6: ...QPB VDDQ VDD DQB DQB DQB NC DQB NC DQA DQA VDD VDDQ VDD VDDQ DQB VDD NC VDD DQA VDD VDDQ DQA VDDQ VDD VDD VDDQ VDD VDDQ DQA VDDQ A A VSS A A A DQB DQB DQB ZZ DQA DQA DQPA DQA A VDDQ A A0 A VSS NC A A...

Страница 7: ...DQPb DQf DQf DQf DQf NC DQa DQa DQa DQa DQPe DQe DQe DQe DQe A A A A NC NC NC 144M A A NC 288M A A A A A A A1 A0 A A A A A A NC 576M NC NC NC NC NC BWSb BWSf BWSe BWSa BWSc BWSg BWSd BWSh TMS TDI TDO...

Страница 8: ...o behave as outputs When deasserted HIGH IO pins are tri stated and act as input data pins OE is masked during the data portion of a write sequence during the first clock when emerging from a deselect...

Страница 9: ...ffers are controlled by OE and the internal control logic OE must be driven LOW to drive out the requested data On the subsequent clock another operation read write deselect can be initiated When the...

Страница 10: ...on DQs and DQPX are automatically tri stated during the data portion of a write cycle regardless of the state of OE Burst Write Accesses The CY7C1471BV33 CY7C1473BV33 and CY7C1475BV33 have an on chip...

Страница 11: ...L L L L H X L L H Tri State Write Abort Continue Burst Next X X X L H X H X L L H Tri State Ignore Clock Edge Stall Current X X X L X X X X H L H Sleep Mode None X X X H X X X X X X Tri State Notes 1...

Страница 12: ...L L L The read write truth table for CY7C1473BV33 follows 1 2 8 Truth Table for Read Write Function WE BWa BWb Read H X X Write No Bytes Written L H H Write Byte a DQa and DQPa L L H Write Byte b DQb...

Страница 13: ...ted to the least significant bit LSB of any register See TAP Controller State Diagram on page 15 Performing a TAP Reset A RESET is performed by forcing TMS HIGH VDD for five rising edges of TCK This R...

Страница 14: ...nstruction causes the boundary scan register to be connected between the TDI and TDO balls when the TAP controller is in a Shift DR state It also places all SRAM outputs into a High Z state SAMPLE PRE...

Страница 15: ...TAP Controller State Diagram TEST LOGIC RESET RUN TEST IDLE SELECT DR SCAN SELECT IR SCAN CAPTURE DR SHIFT DR CAPTURE IR SHIFT IR EXIT1 DR PAUSE DR EXIT1 IR PAUSE IR EXIT2 DR UPDATE DR EXIT2 IR UPDAT...

Страница 16: ...15029 Rev B Page 16 of 32 TAP Controller Block Diagram Bypass Register 0 Instruction Register 0 1 2 Identification Register 0 1 2 29 30 31 Boundary Scan Register 0 1 2 x Selection Circuitry TCK TMS T...

Страница 17: ...5V TAP AC Output Load Equivalent TDO 1 25V 20pF Z 50 O 50 TAP DC Electrical Characteristics and Operating Conditions 0 C TA 70 C VDD 3 3V 0 165V unless otherwise noted 9 Parameter Description Test Co...

Страница 18: ...ns Setup Times tTMSS TMS Setup to TCK Clock Rise 5 ns tTDIS TDI Setup to TCK Clock Rise 5 ns tCS Capture Setup to TCK Rise 5 ns Hold Times tTMSH TMS Hold after TCK Clock Rise 5 ns tTDIH TDI Hold afte...

Страница 19: ...EXTEST 000 Captures IO ring contents Places the boundary scan register between TDI and TDO Forces all SRAM outputs to High Z state This instruction is not 1149 1 compliant IDCODE 001 Loads the ID reg...

Страница 20: ...1 31 P10 51 G10 71 B2 12 L1 32 R9 52 F10 13 J2 33 R10 53 E10 14 M1 34 R11 54 A9 15 N1 35 N11 55 B9 16 K2 36 M11 56 A10 17 L2 37 L11 57 B10 18 M2 38 M10 58 A8 19 R1 39 L10 59 B8 20 R2 40 K11 60 A7 Boun...

Страница 21: ...91 A9 8 D2 36 W2 64 N11 92 U8 9 E1 37 T6 65 N10 93 A6 10 E2 38 V3 66 M11 94 D6 11 F1 39 V4 67 M10 95 K6 12 F2 40 U4 68 L11 96 B6 13 G1 41 W5 69 L10 97 K3 14 G2 42 V6 70 P6 98 A8 15 H1 43 W6 71 J11 99...

Страница 22: ...1 7 VDD 0 3V V VIL Input LOW Voltage 13 For 3 3V IO 0 3 0 8 V For 2 5V IO 0 3 0 7 V IX Input Leakage Current except ZZ and MODE GND VI VDDQ 5 5 A Input Current of MODE Input VSS 30 A Input VDD 5 A Inp...

Страница 23: ...and after any design or process change that may affect these parameters Parameter Description Test Conditions 100 TQFP Max 165 FBGA Max 209 FBGA Max Unit JA Thermal Resistance Junction to Ambient Tes...

Страница 24: ...Before CLK Rise 1 5 1 5 ns tDS Data Input Setup Before CLK Rise 1 5 1 5 ns tCES Chip Enable Setup Before CLK Rise 1 5 1 5 ns Hold Times tAH Address Hold After CLK Rise 0 5 0 5 ns tALH ADV LD Hold Aft...

Страница 25: ...COMMAND tCLZ D A1 D A2 Q A4 Q A3 D A2 1 tDOH tCHZ tCDV WRITE D A2 BURST WRITE D A2 1 READ Q A3 READ Q A4 BURST READ Q A4 1 WRITE D A5 READ Q A6 WRITE D A7 DESELECT OE tOEV tOELZ tOEHZ DON T CARE UNDEF...

Страница 26: ...ms continued READ Q A3 4 5 6 7 8 9 10 A3 A4 A5 D A4 1 2 3 CLK CE WE CEN BW A D ADV LD ADDRESS DQ COMMAND WRITE D A4 STALL WRITE D A1 READ Q A2 STALL NOP READ Q A5 DESELECT CONTINUE DESELECT DON T CARE...

Страница 27: ...forms continued t ZZ I SUPPLY CLK ZZ tZZREC ALL INPUTS except ZZ DON T CARE I DDZZ tZZI tRZZI Outputs Q High Z DESELECT or READ Only Notes 24 Device must be deselected when entering ZZ mode See the Th...

Страница 28: ...3BZI CY7C1471BV33 133BZXI 51 85165 165 Ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Pb Free CY7C1473BV33 133BZXI CY7C1475BV33 133BGI 51 85167 209 Ball Fine Pitch Ball Grid Array 14 22 1 76 mm CY7C...

Страница 29: ...N END FLASH SHALL NOT EXCEED 0 0098 in 0 25 mm PER SIDE 3 DIMENSIONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0 20 1 40 0...

Страница 30: ...1 PIN 1 CORNER 17 00 0 10 15 00 0 10 7 00 1 00 0 45 0 05 165X 0 25 M C A B 0 05 M C B A 0 15 4X 0 35 1 40 MAX SEATING PLANE 0 53 0 05 0 25 C 0 15 C PIN 1 CORNER TOP VIEW BOTTOM VIEW 2 3 4 5 6 7 8 9 1...

Страница 31: ...CY7C1471BV33 CY7C1473BV33 CY7C1475BV33 Document 001 15029 Rev B Page 31 of 32 Figure 10 209 Ball FBGA 14 x 22 x 1 76 mm Package Diagrams continued 51 85167 Feedback...

Страница 32: ...ve works of and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with...

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