background image

CY7C1386DV25, CY7C1386FV25

CY7C1387DV25, CY7C1387FV25

Document Number: 38-05548 Rev. *E

Page 12 of 30

Instruction Register

Three-bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the
TDI and TDO balls as shown in the 

TAP Controller Block

Diagram

. Upon power up, the instruction register is loaded

with the IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state as
described in the previous section.
When the TAP controller is in the Capture-IR state, the two
least significant bits are loaded with a binary ‘01’ pattern to
allow for fault isolation of the board-level serial test data path.

Bypass Register

To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between the
TDI and TDO balls. This allows data to be shifted through the
SRAM with minimal delay. The bypass register is set LOW
(V

SS

) when the BYPASS instruction is executed.

Boundary Scan Register

The boundary scan register is connected to all the input and
bidirectional balls on the SRAM. 
The boundary scan register is loaded with the contents of the
RAM input and output ring when the TAP controller is in the
Capture-DR state and is then placed between the TDI and
TDO balls when the controller is moved to the Shift-DR state.
The EXTEST, SAMPLE/PRELOAD, and SAMPLE Z
instructions can be used to capture the contents of the input
and output ring.
The boundary scan order tables show the order in which the
bits are connected. Each bit corresponds to one of the bumps
on the SRAM package. The MSB of the register is connected
to TDI, and the LSB is connected to TDO.

Identification (ID) Register

The ID register is loaded with a vendor specific, 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired
into the SRAM and can be shifted out when the TAP controller
is in the Shift-DR state. The ID register has a vendor code and
other information described in the 

Identification Register

Definitions on page 15

.

TAP Instruction Set

Overview

Eight different instructions are possible with the three bit
instruction register. All combinations are listed in 

Identification

Codes on page 15

. Three of these instructions are listed as

RESERVED and should not be used. The other five
instructions are described in detail below.
Instructions are loaded into the TAP controller during the
Shift-IR state when the instruction register is placed between
TDI and TDO. During this state, instructions are shifted
through the instruction register through the TDI and TDO balls.

To execute the instruction once it is shifted in, the TAP
controller needs to be moved into the Update-IR state.

EXTEST

The EXTEST instruction enables the preloaded data to be
driven out through the system output pins. This instruction also
selects the boundary scan register to be connected for serial
access between the TDI and TDO in the Shift-DR controller
state.

IDCODE

The IDCODE instruction causes a vendor specific 32-bit code
to be loaded into the instruction register. It also places the
instruction register between the TDI and TDO balls and allows
the IDCODE to be shifted out of the device when the TAP
controller enters the Shift-DR state.
The IDCODE instruction is loaded into the instruction register
upon power up or whenever the TAP controller is given a test
logic reset state.

SAMPLE Z

The SAMPLE Z instruction causes the boundary scan register
to be connected between the TDI and TDO balls when the TAP
controller is in a Shift-DR state. The SAMPLE Z command
places all SRAM outputs into a High-Z state.

SAMPLE/PRELOAD

SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the
instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the input and output pins is
captured in the boundary scan register. 
The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. As there is
a large difference in the clock frequencies, it is possible that
during the Capture-DR state, an input or output will undergo a
transition. The TAP may then try to capture a signal while in
transition (metastable state). This will not harm the device, but
there is no guarantee as to the value that will be captured.
Repeatable results may not be possible.
To guarantee that the boundary scan register will capture the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller's capture setup plus
hold times (t

CS

 and t

CH

). The SRAM clock input might not be

captured correctly if there is no way in a design to stop (or
slow) the clock during a SAMPLE/PRELOAD instruction. If this
is an issue, it is still possible to capture all other signals and
simply ignore the value of the CK and CK captured in the
boundary scan register.
Once the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the
boundary scan register between the TDI and TDO pins.
PRELOAD allows an initial data pattern to be placed at the
latched parallel outputs of the boundary scan register cells pri-
or to the selection of another boundary scan test operation.

[+] Feedback 

Содержание CY7C1386DV25

Страница 1: ...l data inputs address pipelining chip enable CE1 depth expansion chip enables CE2 and CE3 2 burst control inputs ADSC ADSP and ADV write enables BWX and BWE and global write GW Asynchronous inputs inc...

Страница 2: ...LINED ENABLE OUTPUT REGISTERS SENSE AMPS MEMORY ARRAY OUTPUT BUFFERS DQA DQP A BYTE WRITE DRIVER DQB DQP B BYTE WRITE DRIVER DQc DQP C BYTE WRITE DRIVER DQD DQP D BYTE WRITE DRIVER INPUT REGISTERS A0...

Страница 3: ...68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 MODE CY7C1386DV25 512K X 36 NC A A A A A 1 A 0 NC 72M NC 36M V SS V DD A A A A A A A...

Страница 4: ...C VDD DQD DQD DQD DQD ADSC NC CE1 OE ADV GW VSS VSS VSS VSS VSS VSS VSS VSS DQPA MODE DQPD DQPB BWB BWC NC VDD NC BWA NC BWE BWD ZZ 2 3 4 5 6 7 1 A B C D E F G H J K L M N P R T U VDDQ NC 288M NC 144M...

Страница 5: ...Q VDD DQB DQB DQB NC DQB NC DQA DQA VDD VDDQ VDD VDDQ DQB VDD NC VDD DQA VDD VDDQ DQA VDDQ VDD VDD VDDQ VDD VDDQ DQA VDDQ A A VSS A A A DQB DQB DQB ZZ DQA DQA DQPA DQA A VDDQ A CY7C1387DV25 1M x 18 A0...

Страница 6: ...ument for BGA CE3 is sampled only when a new external address is loaded OE Input Asynchronous Output enable asynchronous input active LOW Controls the direction of the IO pins When LOW the IO pins beh...

Страница 7: ...exception occurs when the SRAM is emerging from a deselected state to a selected state its outputs are always tri stated during the first cycle of the access After the first cycle of the access the o...

Страница 8: ...corresponding address location in the memory core If a byte write is conducted only the selected bytes are written Bytes not selected during a byte write operation will remain unaltered A synchronous...

Страница 9: ...X H L H L L H Q READ Cycle Continue Burst Next H X X L X H L H H L H Tri State WRITE Cycle Continue Burst Next X X X L H H L L X L H D WRITE Cycle Continue Burst Next H X X L X H L L X L H D READ Cycl...

Страница 10: ...te D DQD and DQPD H L L H H H Write Bytes D A H L L H H L Write Bytes D B H L L H L H Write Bytes D B A H L L H L L Write Bytes D C H L L L H H Write Bytes D C A H L L L H L Write Bytes D C B H L L L...

Страница 11: ...o the input of any of the registers The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register For information on loading the instruction register s...

Страница 12: ...uring this state instructions are shifted through the instruction register through the TDI and TDO balls To execute the instruction once it is shifted in the TAP controller needs to be moved into the...

Страница 13: ...d into the preload register during the Update DR state in the TAP controller it will directly control the state of the output Q bus pins when the EXTEST is entered as the current instruction When HIGH...

Страница 14: ...Setup to TCK Clock Rise 5 ns tCS Capture Setup to TCK Rise 5 ns Hold Times tTMSH TMS Hold after TCK Clock Rise 5 ns tTDIH TDI Hold after Clock Rise 5 ns tCH Capture Hold after Clock Rise 5 ns TDO 1 25...

Страница 15: ...ID 32 32 Boundary Scan Order 119 ball BGA package 85 85 Boundary Scan Order 165 ball fBGA package 89 89 Identification Codes Instruction Code Description EXTEST 000 Captures IO ring contents Places t...

Страница 16: ...B2 71 K1 6 L5 28 E6 50 B3 72 L2 7 R6 29 D6 51 A3 73 N2 8 U6 30 C7 52 C2 74 P2 9 R7 31 B7 53 A2 75 R3 10 T7 32 C6 54 B1 76 T1 11 P6 33 A6 55 C1 77 R1 12 N7 34 C5 56 D2 78 T2 13 M6 35 B5 57 E1 79 L3 14...

Страница 17: ...37 A9 67 H3 8 P9 38 B9 68 J1 9 P10 39 C10 69 K1 10 R10 40 A8 70 L1 11 R11 41 B8 71 M1 12 H11 42 A7 72 J2 13 N11 43 B7 73 K2 14 M11 44 B6 74 L2 15 L11 45 A6 75 M2 16 K11 46 B5 76 N1 17 J11 47 A5 77 N2...

Страница 18: ...DD 0 3V V VIL Input LOW Voltage 17 for 2 5V IO 0 3 0 7 V IX Input Leakage Current except ZZ and MODE GND VI VDDQ 5 5 A Input Current of MODE Input VSS 30 A Input VDD 5 A Input Current of ZZ Input VSS...

Страница 19: ...Test Conditions 100 TQFP Package 119 BGA Package 165 FBGA Package Unit JA Thermal Resistance Junction to Ambient Test conditions follow standard test methods and procedures for measuring thermal impe...

Страница 20: ...1 4 1 5 ns Hold Times tAH Address Hold After CLK Rise 0 3 0 4 0 5 ns tADH ADSP ADSC Hold After CLK Rise 0 3 0 4 0 5 ns tADVH ADV Hold After CLK Rise 0 3 0 4 0 5 ns tWEH GW BWE BWX Hold After CLK Rise...

Страница 21: ...DQ High Z tDOH tCO ADV tOEHZ tCO SingleREAD BURSTREAD tOEV tOELZ tCHZ Burstwrapsaround toitsinitialstate tADVH tADVS tWEH tWES tADH tADS Q A2 Q A2 1 Q A2 2 Q A1 Q A2 Q A2 1 Q A3 Q A2 3 A2 A3 Deselect...

Страница 22: ...DV BURST READ BURST WRITE D A2 D A2 1 D A3 D A3 1 D A2 3 A2 A3 Extended BURST WRITE Single WRITE tADH tADS tADH tADS t OEHZ tADVH tADVS tWEH tWES t DH t DS GW tWEH tWES Byte write signals are ignored...

Страница 23: ...OE ADSC CE tAH tAS A2 tCEH tCES Data Out Q High Z ADV Single WRITE D A3 A4 A5 A6 D A5 D A6 Data In D BURST READ Back to Back READs High Z Q A2 Q A1 Q A4 tWEH tWES Q A4 3 tOEHZ tDH tDS tOELZ tCLZ tCO...

Страница 24: ...continued t ZZ I SUPPLY CLK ZZ t ZZREC ALL INPUTS except ZZ DON T CARE I DDZZ t ZZI tRZZI Outputs Q High Z DESELECT or READ Only Notes 30 Device must be deselected when entering ZZ sleep mode See cyc...

Страница 25: ...Ball Grid Array 14 x 22 x 2 4 mm Pb Free CY7C1387FV25 167BGXI CY7C1386DV25 167BZI 51 85180 165 ball Fine Pitch Ball Grid Array 13 x 15 x 1 4 mm CY7C1387DV25 167BZI CY7C1386DV25 167BZXI 51 85180 165 b...

Страница 26: ...y 13 x 15 x 1 4 mm Pb Free CY7C1387DV25 250BZXC CY7C1386DV25 250AXI 51 85050 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Pb Free Industrial CY7C1387DV25 250AXI CY7C1386FV25 250BGI 51 85115 119 ball B...

Страница 27: ...OLD PROTRUSION END FLASH SHALL NOT EXCEED 0 0098 in 0 25 mm PER SIDE 3 DIMENSIONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 0...

Страница 28: ...CY7C1386DV25 CY7C1386FV25 CY7C1387DV25 CY7C1387FV25 Document Number 38 05548 Rev E Page 28 of 30 Figure 2 119 Ball BGA 14 x 22 x 2 4 mm 51 85115 Package Diagrams continued 51 85115 B Feedback...

Страница 29: ...s of Intel Corporation PowerPC is a trademark of IBM Corporation All product and company names mentioned in this document are the trademarks of their respective holders Figure 3 165 Ball FBGA 13 x 15...

Страница 30: ...and 4 08 C W respectively Changed JA and JC for BGA Package from 45 and 7 C W to 23 8 and 6 2 C W respectively Changed JA and JC for FBGA Package from 46 and 3 C W to 20 7 and 4 0 C W respectively Mo...

Отзывы: