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CY7C1386D, CY7C1386F

CY7C1387D, CY7C1387F

Document Number: 38-05545 Rev. *E

Page 11 of 30

IEEE 1149.1 Serial Boundary Scan (JTAG)

The CY7C1386D/CY7C1387D/CY7C1386F/CY7C1387F

incorporates a serial boundary scan test access port (TAP).

This part is fully compliant with 1149.1. The TAP operates

using JEDEC-standard 3.3V or 2.5V IO logic levels.
The CY7C1386D/CY7C1387D/CY7C1386F/CY7C1387F

contains a TAP controller, instruction register, boundary scan

register, bypass register, and ID register.

Disabling the JTAG Feature

It is possible to operate the SRAM without using the JTAG

feature. To disable the TAP controller, TCK must be tied LOW

(V

SS

) to prevent clocking of the device. TDI and TMS are

internally pulled up and may be unconnected. They may

alternately be connected to V

DD 

through a pull up resistor.

TDO can be left unconnected. Upon power up, the device will

come up in a reset state which will not interfere with the

operation of the device.

TAP Controller State Diagram

The 0 or 1 next to each state represents the value of TMS at

the rising edge of TCK.

Test Access Port (TAP)

Test Clock (TCK)

The test clock is used only with the TAP controller. All inputs

are captured on the rising edge of TCK. All outputs are driven

from the falling edge of TCK.

Test Mode Select (TMS)

The TMS input is used to give commands to the TAP controller

and is sampled on the rising edge of TCK. This pin may be left

unconnected if the TAP is not used. The ball is pulled up

internally, resulting in a logic HIGH level.

Test Data-In (TDI)

The TDI ball is used to serially input information into the

registers and can be connected to the input of any of the

registers. The register between TDI and TDO is chosen by the

instruction that is loaded into the TAP instruction register. TDI

is internally pulled up and can be unconnected if the TAP is

unused in an application. TDI is connected to the most signif-

icant bit (MSB) of any register. (See 

TAP Controller Block

Diagram

).

Test Data-Out (TDO)

The TDO output ball is used to serially clock data out from the

registers. The output is active depending upon the current

state of the TAP state machine. The output changes on the

falling edge of TCK. TDO is connected to the least significant

bit (LSB) of any register. (See 

TAP Controller State Diagram

).

TAP Controller Block Diagram

Performing a TAP Reset

A Reset is performed by forcing TMS HIGH (V

DD

) for five rising

edges of TCK. This Reset does not affect the operation of the

SRAM and may be performed while the SRAM is operating.
At power up, the TAP is reset internally to ensure that TDO

comes up in a High-Z state.

TAP Registers

Registers are connected between the TDI and TDO balls and

allow data to be scanned into and out of the SRAM test

circuitry. Only one register can be selected at a time through

the instruction register. Data is serially loaded into the TDI ball

on the rising edge of TCK. Data is output on the TDO ball on

the falling edge of TCK.

Instruction Register

Three-bit instructions can be serially loaded into the instruction

register. This register is loaded when it is placed between the

TDI and TDO balls as shown in the 

TAP Controller Block

Diagram

. Upon power up, the instruction register is loaded

with the IDCODE instruction. It is also loaded with the IDCODE

instruction if the controller is placed in a reset state as

described in the previous section.

TEST-LOGIC

RESET

RUN-TEST/

IDLE

SELECT

DR-SCAN

SELECT

IR-SCAN

CAPTURE-DR

SHIFT-DR

CAPTURE-IR

SHIFT-IR

EXIT1-DR

PAUSE-DR

EXIT1-IR

PAUSE-IR

EXIT2-DR

UPDATE-DR

EXIT2-IR

UPDATE-IR

1

1

1

0

1

1

0

0

1

1

1

0

0

0

0

0

0

0

0

0

1

0

1

1

0

1

0

1

1

1

1

0

Bypass Register

0

Instruction Register

0

1

2

Identification Register

0

1

2

29

30

31

.

.

.

Boundary Scan Register

0

1

2

.

.

x

.

.

.

    S

election

    Circuitr

y

Selection

Circuitry

TCK

TMS

TAP CONTROLLER

TDI

TDO

[+] Feedback 

Содержание CY7C1386D

Страница 1: ...ning chip enable CE1 depth expansion chip enables CE2 and CE3 2 burst control inputs ADSC ADSP and ADV write enables BWX and BWE and global write GW Asynchronous inputs include the output enable OE an...

Страница 2: ...BLE OUTPUT REGISTERS SENSE AMPS MEMORY ARRAY OUTPUT BUFFERS DQA DQP A BYTE WRITE DRIVER DQB DQP B BYTE WRITE DRIVER DQc DQP C BYTE WRITE DRIVER DQD DQP D BYTE WRITE DRIVER INPUT REGISTERS A0 A1 A A 1...

Страница 3: ...67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 MODE CY7C1386D 512K X 36 NC A A A A A 1 A 0 NC 72M NC 36M V SS V DD A A A A A A A A A N...

Страница 4: ...DQD DQD DQD DQD ADSC NC CE1 OE ADV GW VSS VSS VSS VSS VSS VSS VSS VSS DQPA MODE DQPD DQPB BWB BWC NC VDD NC BWA NC BWE BWD ZZ 2 3 4 5 6 7 1 A B C D E F G H J K L M N P R T U VDDQ NC 288M NC 144M NC DQ...

Страница 5: ...DQB DQB DQB NC DQB NC DQA DQA VDD VDDQ VDD VDDQ DQB VDD NC VDD DQA VDD VDDQ DQA VDDQ VDD VDD VDDQ VDD VDDQ DQA VDDQ A A VSS A A A DQB DQB DQB ZZ DQA DQA DQPA DQA A VDDQ A CY7C1387D 1M x 18 A0 A VSS 2...

Страница 6: ...ocument for BGA CE3 is sampled only when a new external address is loaded OE Input Asynchronous Output enable asynchronous input active LOW Controls the direction of the IO pins When LOW the IO pins b...

Страница 7: ...ion occurs when the SRAM is emerging from a deselected state to a selected state its outputs are always tri stated during the first cycle of the access After the first cycle of the access the outputs...

Страница 8: ...synchronous self timed write mechanism has been provided to simplify the write operations The CY7C1386D CY7C1387D CY7C1386F CY7C1387F is a common IO device the output enable OE must be deasserted HIGH...

Страница 9: ...ite Cycle Continue Burst Next H X X L X H L L X L H D Read Cycle Suspend Burst Current X X X L H H H H L L H Q Read Cycle Suspend Burst Current X X X L H H H H H L H Tri State Read Cycle Suspend Burst...

Страница 10: ...nd DQPD H L L H H H Write Bytes D A H L L H H L Write Bytes D B H L L H L H Write Bytes D B A H L L H L L Write Bytes D C H L L L H H Write Bytes D C A H L L L H L Write Bytes D C B H L L L L H Write...

Страница 11: ...nconnected if the TAP is unused in an application TDI is connected to the most signif icant bit MSB of any register See TAP Controller Block Diagram Test Data Out TDO The TDO output ball is used to se...

Страница 12: ...ls and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift DR state The IDCODE instruction is loaded into the instruction register upon power up or whenever the...

Страница 13: ...hese instructions are not implemented but are reserved for future use Do not use these instructions TAP Timing TAP AC Switching Characteristics Over the Operating Range 10 11 Parameter Description Min...

Страница 14: ...quivalent TDO 1 5V 20pF Z 50 O 50 TDO 1 25V 20pF Z 50 O 50 TAP DC Electrical Characteristics And Operating Conditions 0 C TA 70 C VDD 3 3V 0 165V unless otherwise noted 12 Parameter Description Test C...

Страница 15: ...5 85 Boundary Scan Order 165 ball FBGA package 89 89 Identification Codes Instruction Code Description EXTEST 000 Captures IO ring contents Places the boundary scan register between TDI and TDO Forces...

Страница 16: ...K1 6 L5 28 E6 50 B3 72 L2 7 R6 29 D6 51 A3 73 N2 8 U6 30 C7 52 C2 74 P2 9 R7 31 B7 53 A2 75 R3 10 T7 32 C6 54 B1 76 T1 11 P6 33 A6 55 C1 77 R1 12 N7 34 C5 56 D2 78 T2 13 M6 35 B5 57 E1 79 L3 14 L7 36...

Страница 17: ...67 H3 8 P9 38 B9 68 J1 9 P10 39 C10 69 K1 10 R10 40 A8 70 L1 11 R11 41 B8 71 M1 12 H11 42 A7 72 J2 13 N11 43 B7 73 K2 14 M11 44 B6 74 L2 15 L11 45 A6 75 M2 16 K11 46 B5 76 N1 17 J11 47 A5 77 N2 18 M1...

Страница 18: ...r 3 3V IO 2 0 VDD 0 3V V for 2 5V IO 1 7 VDD 0 3V V VIL Input LOW Voltage 17 for 3 3V IO 0 3 0 8 V for 2 5V IO 0 3 0 7 V IX Input Leakage Current except ZZ and MODE GND VI VDDQ 5 5 A Input Current of...

Страница 19: ...Junction to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance in accordance with EIA JESD51 28 66 23 8 20 7 C W JC Thermal Resistance Junction to Cas...

Страница 20: ...5 ns Hold Times tAH Address Hold After CLK Rise 0 3 0 4 0 5 ns tADH ADSP ADSC Hold After CLK Rise 0 3 0 4 0 5 ns tADVH ADV Hold After CLK Rise 0 3 0 4 0 5 ns tWEH GW BWE BWX Hold After CLK Rise 0 3 0...

Страница 21: ...h Z tDOH tCO ADV tOEHZ tCO SingleREAD BURSTREAD tOEV tOELZ tCHZ Burstwrapsaround toitsinitialstate tADVH tADVS tWEH tWES tADH tADS Q A2 Q A2 1 Q A2 2 Q A1 Q A2 Q A2 1 Q A3 Q A2 3 A2 A3 Deselect cycle...

Страница 22: ...ST READ BURST WRITE D A2 D A2 1 D A3 D A3 1 D A2 3 A2 A3 Extended BURST WRITE Single WRITE tADH tADS tADH tADS t OEHZ tADVH tADVS tWEH tWES t DH t DS GW tWEH tWES Byte write signals are ignored for rs...

Страница 23: ...SC CE tAH tAS A2 tCEH tCES Data Out Q High Z ADV Single WRITE D A3 A4 A5 A6 D A5 D A6 Data In D BURST READ Back to Back READs High Z Q A2 Q A1 Q A4 tWEH tWES Q A4 3 tOEHZ tDH tDS tOELZ tCLZ tCO Back t...

Страница 24: ...nued t ZZ I SUPPLY CLK ZZ t ZZREC ALL INPUTS except ZZ DON T CARE I DDZZ t ZZI tRZZI Outputs Q High Z DESELECT or READ Only Notes 30 Device must be deselected when entering ZZ sleep mode See cycle des...

Страница 25: ...119 ball Ball Grid Array 14 x 22 x 2 4 mm Pb Free CY7C1387F 167BGXI CY7C1386D 167BZI 51 85180 165 ball Fine Pitch Ball Grid Array 13 x 15 x 1 4 mm CY7C1387D 167BZI CY7C1386D 167BZXI 51 85180 165 ball...

Страница 26: ...3 x 15 x 1 4 mm Pb Free CY7C1387D 250BZXC CY7C1386D 250AXI 51 85050 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Pb Free Industrial CY7C1387D 250AXI CY7C1386F 250BGI 51 85115 119 ball Ball Grid Array...

Страница 27: ...PROTRUSION END FLASH SHALL NOT EXCEED 0 0098 in 0 25 mm PER SIDE 3 DIMENSIONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0...

Страница 28: ...CY7C1386D CY7C1386F CY7C1387D CY7C1387F Document Number 38 05545 Rev E Page 28 of 30 Figure 2 119 Ball BGA 14 x 22 x 2 4 mm 51 85115 Package Diagrams continued 51 85115 B Feedback...

Страница 29: ...is a trademark of Intel Corporation PowerPC is a trademark of IBM Corporation All product and company names mentioned in this document are the trademarks of their respective holders Figure 3 165 Ball...

Страница 30: ...nd JC for BGA Package from 45 and 7 C W to 23 8 and 6 2 C W respectively Changed JA and JC for FBGA Package from 46 and 3 C W to 20 7 and 4 0 C W respectively Modified VOL VOH test conditions Removed...

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