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Document #: 001-08029 Rev. *E

Page 5 of 13

CY62138FV30 MoBL

®

Switching Characteristics 

(Over the Operating Range) 

[11]

Parameter

Description

45 ns

Unit

Min

Max

Read Cycle

t

RC

Read Cycle Time

45

ns

t

AA

Address to Data Valid

45

ns

t

OHA

Data Hold from Address Change

10

ns

t

ACE

CE

LOW and CE

HIGH to Data Valid

45

ns

t

DOE

OE LOW to Data Valid

22

ns

t

LZOE

OE LOW to Low-Z 

[12]

5

ns

t

HZOE

OE HIGH to High-Z 

[12,13]

18

ns

t

LZCE

CE

LOW and CE

HIGH to Low Z 

[12]

10

ns

t

HZCE

CE

HIGH or CE

LOW to High-Z 

[12, 13]

18

ns

t

PU

CE

LOW and CE

HIGH to Power Up

0

ns

t

PD

CE

HIGH or CE

LOW to Power Down

45

ns

Write Cycle 

[14]

t

WC

Write Cycle Time

45

ns

t

SCE

CE

LOW and CE

HIGH to Write End

35

ns

t

AW

Address Setup to Write End

35

ns

t

HA

Address Hold from Write End

0

ns

t

SA

Address Setup to Write Start

0

ns

t

PWE

WE Pulse Width

35

ns

t

SD

Data Setup to Write End

25

ns

t

HD

Data Hold from Write End

0

ns

t

HZWE

WE LOW to High-Z 

[12, 13]

18

ns

t

LZWE

WE HIGH to Low-Z 

[12]

10

ns

Notes

11. Test conditions for all parameters other than tri-state parameters assume signal transition time of 3 ns or less (1 V/ns), timing reference levels of V

CC(typ)

/2, input 

pulse levels of 0 to V

CC(typ)

, and output loading of the specified I

OL

/I

OH

 as shown in the “

“AC Test Loads and Waveforms” on page 4

” .

12. At any given temperature and voltage condition, t

HZCE

 is less than t

LZCE

, t

HZOE

 is less than t

LZOE

, and t

HZWE

 is less than t

LZWE

 for any given device.

13. t

HZOE

, t

HZCE

, and t

HZWE

 transitions are measured when the output enters a high impedance state.

14. The internal write time of the memory is defined by the overlap of WE, CE

= V

IL

, and CE

= V

IH

. All signals must be ACTIVE to initiate a write and any of these 

signals can terminate a write by going INACTIVE. Reference the data input setup and hold timing to the edge of the signal that terminates the write.

[+] Feedback 

Содержание CY62138FV30

Страница 1: ...own feature that significantly reduces power consumption Place the device into standby mode reducing power consumption when deselected CE1 HIGH or CE2 LOW To write to the device take Chip Enable CE1 L...

Страница 2: ...17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 VSS VCC CE2 WE OE CE1 A6 A7 A16 A14 A12 WE VCC A4 A13 A8 A9 OE TSOP I Top View not to scale 1 6 2 3 4 5 7 3...

Страница 3: ...For BGA package 0 3 0 6 V VCC 2 7V to 3 6V 0 3 0 8 V VCC 2 2V to 3 6V For other packages 0 3 0 6 V IIX Input Leakage Current GND VI VCC 1 1 A IOZ Output Leakage Current GND VO VCC output disabled 1 1...

Страница 4: ...meter Description Conditions Min Typ 3 Max Unit VDR VCC for Data Retention 1 5 V ICCDR 7 Data Retention Current VCC 1 5V CE1 VCC 0 2V or CE2 0 2V VIN VCC 0 2V or VIN 0 2V 1 4 A tCDR 8 Chip Deselect to...

Страница 5: ...h 35 ns tSD Data Setup to Write End 25 ns tHD Data Hold from Write End 0 ns tHZWE WE LOW to High Z 12 13 18 ns tLZWE WE HIGH to Low Z 12 10 ns Notes 11 Test conditions for all parameters other than tr...

Страница 6: ...EDANCE ICC ISB HIGH ADDRESS CE DATA OUT VCC SUPPLY CURRENT OE DATA VALID tHD tSD tPWE tSA tHA tAW tSCE tWC tHZOE ADDRESS CE WE DATA IO OE NOTE 20 Notes 15 The device is continuously selected OE CE1 VI...

Страница 7: ...wer H X X X High Z Deselect Power Down Standby ISB X L X X High Z Deselect Power Down Standby ISB L H H L Data Out Read Active ICC L H H H High Z Output Disabled Active ICC L H L X Data in Write Activ...

Страница 8: ...32 pin STSOP Pb free CY62138FV30LL 45ZXI 51 85056 32 pin TSOP I Pb free CY62138FV30LL 45SXI 51 85081 32 pin SOIC Pb free Package Diagrams Figure 1 36 ball VFBGA 6 x 8 x 1 mm 51 85149 A 1 A1 CORNER 0...

Страница 9: ...Document 001 08029 Rev E Page 9 of 13 CY62138FV30 MoBL Figure 2 32 pin TSOP II 51 85095 Package Diagrams continued 51 85095 Feedback...

Страница 10: ...ms continued 0 546 13 868 0 440 11 176 0 101 2 565 0 050 1 270 0 014 0 355 0 118 2 997 0 004 0 102 0 047 1 193 0 006 0 152 0 023 0 584 0 793 20 142 0 450 11 430 0 566 14 376 0 111 2 819 0 817 20 751 B...

Страница 11: ...Document 001 08029 Rev E Page 11 of 13 CY62138FV30 MoBL Figure 4 32 pin TSOP I 8 x 20 mm 51 85056 Package Diagrams continued 51 85056 D Feedback...

Страница 12: ...en agreement with Cypress Furthermore Cypress does not authorize its products for use as critical components in life support systems where a malfunction or failure may reasonably be expected to result...

Страница 13: ...orrected typo in 32 pin TSOP II pin configuration diagram on page 2 changed pin 24 from CE1to OE and pin 22 from CE to CE1 Changed the ICC max value from 2 25 mA to 2 5 mA for test condition f 1 MHz C...

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