CIrCuIt boarD prEparatIon & Layouts
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or
soldering XLamp ML family LeDs onto the PCB. The diagram below shows the recommended PCB solder pad layout for XLamp ML family
LeDs.
All dimensions in mm.
For additional information about FR4 thermal vias, illustrated above, consult Cree’s
Optimizing PCB Thermal Performance
application
note.
recommended Fr4 solder pad
recommended MCpCb solder pad
MX3535 Pad Layout
recommended stencil pattern
(Hatched area Is opening)
MX3535 Pad Layout
alternative solder pad
MX3535 Pad Layout
33
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trademarks of Cree, Inc. Other
trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided
for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree
Sales at [email protected].
3
XLamp
®
mL FamiLy LED SoLDEring & HanDLing
