SOLDERING & HANDLING
Cree LED / 4400 Silicon Drive / Durham, NC 27703 USA / +1.919.313.5330 /
© 2010-2021 Cree LED. The information in this document is subject to change without notice. Cree
®
and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Wolfspeed Inc. XLamp
®
is a registered trademark of Cree LED. Other trademarks, product and company names
are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document
is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available
at www.cree-led.com.
CLD-AP50
REV 10
1
XLamp
®
ML Family LEDs
INTRODUCTION
This application note applies to XLamp
®
ML family LEDs, which
have order codes in the following fomat:
MLxxxx-xx-xxxx-xxxxxx
This application note explains how XLamp ML family LEDs and
assemblies containing these LEDs should be handled during
manufacturing. Please read the entire document to understand
how to properly handle XLamp ML family LEDs.
TABLE OF CONTENTS
ML Family LEDs ..................................................2
Circuit Board Preparation & Layouts ................................................3
Case Temperature (T
) Measurement Point ....................................4
ML family LEDs..................................4
Low Temperature Operation .............................................................7
XLamp
ML Family LED Reflow Soldering Characteristics
Chemicals & Conformal Coatings ....................................................9
Assembly Storage & Handling ....................................................... 10
Tape and Reel ................................................................................. 11
Packaging & Labels ....................................................................... 12