DSB75 Development Support Board Rev. B1 Hardware Description
Confidential / Released
DSB75_hd_v12
Page 24 of 96
2008-08-26
Table 5: Pin assignment of B2B connector X100
Pin no.
Signal name
Signal name
Pin no.
80
GND
GND
1
79
DAC_OUT
ADC1_IN
2
78
PWR_IND
ADC2_IN
3
77
TP_ENV
GND
4
76
RXD2_GPIO9
TXD2_GPIO10
5
75
SPICS
SD_WP(GPIO8)
6
74
SD_3(GPIO4)
SPIDI
7
73
SD_2(GPIO3)
SD_DET(GPIO7)
8
72
SD_1(GPIO2)
SD_CMD(GPIO6)
9
71
SD_0(GPIO1)
SD_CLK(GPIO5)
10
70
I2CDAT
I2CCLK
11
69
USB_DP
VUSB_IN
12
68
USB_DN
USC5
13
67
VSENSE
ISENSE
14
66
VMIC
USC6
15
65
EPN2
CCCLK
16
64
EPP2
VSIM
17
63
EPP1
CCIO
18
62
EPN1
CCRST
19
61
MICN2
CCIN
20
60
MICP2
CCGND
21
59
MICP1
USC4
22
58
MICN1
USC3
23
57
AGND
USC2
24
56
IGT
USC1
25
55
EMERG_RST
USC0
26
54
DCD0
BATTEMP
27
53
CTS1
SYNC
28
52
CTS0
RXD1
29
51
RTS1
RXD0
30
50
DTR0
TXD1
31
49
RTS0
TXD0
32
48
DSR0
VDDLP
33
47
RING0
VCHARGE
34
46
VEXT
CHARGEGATE
35
45
BATT+
GND
36
44
BATT+
GND
37
43
BATT+
GND
38
42
BATT+
GND
39
41
BATT+
GND
40
Note:
The electrical
characteristics of this
interface meet the
requirements of GSM
module’s application
interface.