Contents
page 4
embedded-logic
CB3055
4.3.10
Network Stack ..................................................................................................................... 57
4.3.11
CPU PPM Configuration ..................................................................................................... 58
4.3.12
Intel(R) GigabitNetworkConnection .................................................................................... 59
4.4
Chipset ........................................................................................................................................ 61
4.4.1
PCH-IO Configuration ......................................................................................................... 62
4.4.2
System Agent (SA) Configuration ....................................................................................... 69
4.5
Boot ............................................................................................................................................. 78
4.5.1
CSM Parameters ................................................................................................................ 80
4.6
Security ....................................................................................................................................... 81
4.6.1
Secure Boot Policy ............................................................................................................. 82
4.6.2
Key Management ................................................................................................................ 83
4.7
Save & Exit ................................................................................................................................. 85
4.8
BIOS-Update .............................................................................................................................. 86
5
Mechanical Drawings ......................................................................................................................... 87
5.1
PCB: Mounting Holes ................................................................................................................. 87
5.2
PCB: Pin 1 Dimensions .............................................................................................................. 88
5.3
PCB: Die Center ......................................................................................................................... 89
6
Technical Data ................................................................................................................................... 90
6.1
Electrical Data ............................................................................................................................. 90
6.2
Environmental Conditions ........................................................................................................... 90
6.3
Thermal Specifications ............................................................................................................... 91
7
Support and Service .......................................................................................................................... 92
7.1
Beckhoff's Branch Offices and Representatives ........................................................................ 92
7.2
Beckhoff Headquarters ............................................................................................................... 92
7.2.1
Beckhoff Support ................................................................................................................ 92
7.2.2
Beckhoff Service ................................................................................................................. 92
I
Annex: Post-Codes ............................................................................................................................ 94
II
Annex: Resources .............................................................................................................................. 95
IO Range ................................................................................................................................................ 95
Memory Range ....................................................................................................................................... 95
Interrupt .................................................................................................................................................. 95
PCI Devices ............................................................................................................................................ 96
SMB Devices .......................................................................................................................................... 96
Содержание CB3055
Страница 2: ......
Страница 5: ...Notes on the Documentation Chapter Document History Beckhoff New Automation Technology CB3055 page 5...
Страница 24: ...Chapter Connectors VGA DVI page 24 Beckhoff New Automation Technology CB3055 Pin Name Description C5 GND ground...
Страница 93: ...Annex Post Codes Beckhoff New Automation Technology CB3055 page 93...