Chapter:
Overview
Specifications and Documents
page 14
Beckhoff New Automation Technology
CB1050
2.2 Specifications and Documents
In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.
ATX specification
Version 2.2
www.formfactors.org
PCI specification
Version 2.3 resp. 3.0
www.pcisig.com
AGP specification
Version 3.0
http://members.datafast.net.au/~dft0802/
ACPI specification
Version 3.0
www.acpi.info
ATA/ATAPI specification
Version 7 Rev. 1
www.t13.org
USB specifications
www.usb.org
SM-Bus specification
Version 2.0
www.smbus.org
Intel® chip set description
Intel® 855GM/855GME Chipset Graphics and Memory Controller Hub
www.intel.com
Intel® chip descriptions
ICH4 Datasheet
www.intel.com
Intel® chip descriptions
Celeron® M, Pentium® M
www.intel.com
Winbond® chip description
W83627HF Datasheet
www.winbond-usa.com oder www.winbond.com.tw
Intel® chip description
82562EZ/GZ Datasheet
www.intel.com
Intel® chip description
82541ER Datasheet
www.intel.com
ICS® chip description
ICS950813 Datasheet
www.idt.com