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75 Automation PC 620 with 945GME N270 CPU board User's Manual V 1.10
2.6 Ambient temperatures for systems with X945 CPU board
It is possible to combine CPU boards with various other components, such as drives, main
memory, additional insert cards, etc. dependent on system unit and fan kit. The various
configurations result in varying maximum possible ambient temperatures, which can be seen in
the following graphic (see figure 2.6 "Ambient temperatures for systems with X945 CPU board",
on page 75).
Experience has shown that higher ambient temperatures can be reached under typical
conditions, e.g. using Microsoft Windows. The testing and evaluation is to be done on-site by the
user (temperatures can be read in BIOS or using the B&R Control Center, see the chapter 4
"Software", on page 265).
Worst-case conditions for systems with an X945 CPU board
• Thermal Analysis Tool V1.4 from Intel for simulating 100% processor load.
• BurnIn testing tool (BurnIn V4.0 Pro from Passmark Software) to simulate a 100% load
on the interface via loop-back adapters (serial interfaces, add-on and slide-in drives, USB
interfaces, audio outputs)
• Maximum system extension and power consumption.
Information:
The maximum specified ambient temperatures were determined under worst-case
conditions.
Figure 22: Example of worst-case conditions for temperature measurement
PCI card(s)
CPU module
heat build-up
PCI cards
heat build-up
Slide-in drive(s)
CPU module
Add-on drive
main heat dissipation
via heat sink
View from above