ETM831 Series Quick Installation Guide
©
Copyright 2009 AXIOMTEK Co., Ltd.
Version A1 November 2009
Printed in Taiwan
9418G831000E
2
IV.
Board
Layout
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Component Side
Solder Side
ETM831 Series Quick Installation Guide
©
Copyright 2009 AXIOMTEK Co., Ltd.
Version A1 November 2009
Printed in Taiwan
9418G831000E
3
V.
Heatspreader
Installation
1. There is a protective plastic covering on the thermal pads. This
must be removed before the heatspreader can be mounted.
Each heatspreader is designed for a specific ETM module. The
thermal pads on the heatspreader are designed to make contact
with the necessary components on the ETM module. When
mounting the heatspreader you must make sure that the thermal
pads on the heatspreader make complete contact (no space
between thermal pad and component) with the corresponding
components on the ETM module. This is especially critical for ETM
modules that have higher CPU speeds (for example 1.0GHz or
more) to ensure that the heatspreader acts as a proper thermal
interface for cooling solutions.
2. The two M2.5x12 screws and two M2.5x8 screws are used to mount
the heatspreader and ETM module assembly to the baseboard.
(see Figure 1)
3. If you have an additional thermal solution on the heatspreader,
please refer to the
ETM831 thermal solution design guide
(see
Figure 2) to design your thermal solution.
Figure 1: ETM831 Heatspreader Assembly Guide
Ple
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1
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