12
Appendix B: Bill of Materials for components shown on the circuit.
Comment
Footprint
Quantity
Cer. Cap 0.1uF (104)
0805
6
Cer. Cap 2.2uF, 16V
CASE A
2
Cer. Cap 4.7pF, 20V
CASE A
2
Cer. Cap 470pF
CASE A
1
Chip RES. 10K 1% 0.125W
0805
2
Chip RES. 12.7K 1% 0.125W
0805
1
Chip RES 2K7 1% 0.125W
0805
1
Chip RES 20K 1% 0.125W
0805
4
Chip RES 100K 1% 0.125W
0805
1
Chip RES 240R 1% 0.125W
0805
1
Photo Transistor
DIP
1
2N3906
TO-92
1
Crystal, 6MHz
DIP
1
Crystal, 24MHz
DIP
1
SPCP825A
DIP-24
1
ADNS-6000
DIP-20
1
25LC040/P
SO-8
1
HEADER 5
HEADLOCK5P
1
LED
DIP
1
LP2950ACZ-3.3
TO-92
1
Jumper, RED
DIP
1
Jumper, BLK
DIP
1
VCSEL
DIP
1
SW SPDT
DIP
3