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[ZigBit 900 MHz Wireless Modules]
16
The ZigBit’s location and orientation on the carrier board is illustrated in the above PCB Land pattern and Mounting
information drawing. The Recommended placement of ZigBit on Carrier Board needs to be accurately followed to
ensure performance on the end application
3.6
Soldering profile
The J-STD-020C-compliant soldering profile is recommended according to
Table 3-6.
Soldering profile
(1)
.
Profile feature
Green package
Average ramp-up rate (217°C to peak)
3°C/s max
Preheat temperature 175°C ±25°C
180s max
Temperature maintained above 217°C
60s to 150s
Time within 5°C of actual peak temperature
20s to 40s
Peak temperature range
260°C
Ramp-down rate
6°C/s max
Time within 25°C to peak temperature
8 minutes
Note:
1. The package is backward compatible with PB/Sn soldering profile.
