Asus P735, Руководство по обслуживанию

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Lv3Lv4 Repair Manual
- 19 - ASUS Proprietary
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11. Underfill Rework Notice
Purpose
：
Set up the underfill rework role, guarantee the quality that FAE repairs.
11.1 Scope:
Personnel that all is maintained and the reworked is correlated with
11.2 Necessary tool and equipment
： ： ： ：
5.2.1 Iron
：
16-T00531807
（
SD-80
）
5.2.2 Iron-head
：
16GPFT008046
5.2.3 Hot Air Gun
：
20-T004A3002
5.2.4 Solder Measurement device
：
16-000603100
5.2.5 Solder-wire
：
16GSST012011
（
Lead free (T=0.6MM)
）
5.2.6 Flux
：
16GPCT001010
（
α
Lead free EF-8000
）
5.2.7 Cleaner
：
16GPCT020053
（
IC-TS00
）
5.2.8 Cotton
：
16-T00380809
（
315MM*10.5M
）
5.2.9 Solder paste
：
16GPCT022057 ( PF601)
11.3 Work method
： ： ： ：
5.3.1 It must last 8 hours to toast PCB board by 125 degrees Centigrade before the
rework of underfill
。
5.3.2 Use the hot air gun to invite 10cm distance above the part and set up and heat
time as 20sec, use the tweezers to remove glueing in the white glue part of BGA.
5.3.3 Use BGA machine to remove the underfill part, the temperature is set up to 255
degrees, use the tweezers to remove component in the 10 sec lastly.
。
5.3.4 Use Iron and soldering paste to clean incomplete glue and soldering ball of PCB
PAD.
5.3.5 Remove incomplete glue and soldering ball of PCB, add the tin once again by
PCB PAD part, and visual have incomplete glue.
5.3.6 Whether it is intact and damaging to examine PCB PAD in item after using the
sanitizer to polish PCB PAD clean.
5.3.7 Use the soldering paste to daub on PCB PAD, put the new part and rework.