136
ZD613
093G 39S 24 T
RLZ 5.6B LLDS
D602
093G 60S 15 T
DIODE RB160M-60TE25 SOD-123 ROHM
D713
093G 60S913 T
DIODE RB501V-40 SOD-323
D707 093G
64S3PH
BAS32L
D711 093G
64S3PH
BAS32L
ZD105
093G 64S500 SU
ESD MLVG04025R0QV05BP INPAQ
ZD104
093G 64S500 SU
ESD MLVG04025R0QV05BP INPAQ
ZD102
093G 64S500 SU
ESD MLVG04025R0QV05BP INPAQ
ZD101
093G 64S500 SU
ESD MLVG04025R0QV05BP INPAQ
ZD100
093G 64S500 SU
ESD MLVG04025R0QV05BP INPAQ
CN704
311GW125A42ACH
WAFER 1.25MM 42P
E715
715G4727M0D000005I
MAIN PCB FR4 4L 193X186X1.6MM
E715 715G4727M0D000005K
MAIN
PCB FR4 4L 193X186X1.6MM
2nd source
Q05G6054 1
SHEET
Q09G6012 1
PIN
X90G8013 1
HEAT SINK
For U200
X90G8014 1
HEAT SINK
For U603
KEPFBXAAC
KEY
BOARD
CN101
033G8032 7F S HR
CONNECTOR 7P 1.25
052G 2191 A
PAPER TAPE
052G6026 2
MESH PRINTTING PAPER
055G 23520
IPA
055G 100610
TIN CREAM W/O PB
U102
056G 669 32
TOUCH KEY IT7235BFN-3104/AX(R) QFN24
R110
061G0402000 FF
RST CHIPR MAX0R01 1/16W FENGHUA
R111
061G0402000 FF
RST CHIPR MAX0R01 1/16W FENGHUA
R125
061G0402000 FF
RST CHIPR MAX0R01 1/16W FENGHUA
R115
061G04021000FT
RST CHIP 100R 1/16W 1%
R117
061G04021000FT
RST CHIP 100R 1/16W 1%
R112
061G0402101 JF
RST CHIPR 100 OHM +-5% 1/16W FENGHUA
R122
061G04022001FF
RST CHIPR 2KOHM +-1% 1/16W FENGHUA
R118
061G04024701FF
RST CHIP 4K7 1/16W 1% FENGHUA
R120
061G04024701FF
RST CHIP 4K7 1/16W 1% FENGHUA
R119
061G0402752 JF
RST CHIP 7K5 1/16W 5% FENGHUA
R121
061G0402752 JF
RST CHIP 7K5 1/16W 5% FENGHUA
C104
065G040210131J Y
CAP CHIP 0402 100P 50V NP0 +/-5%
C101
065G040210427Z Y
CAP 0402 100NF -20%+80% 25V Y5V
C102
065G040210427Z Y
CAP 0402 100NF -20%+80% 25V Y5V
C103
065G040210427Z Y
CAP 0402 100NF -20%+80% 25V Y5V
C105
065G040210427Z Y
CAP 0402 100NF -20%+80% 25V Y5V
715G4682K0C000004S
KEY
PCB
FR4 DS 10 X 124 X1.6MM
Q05G6054 1
SHEET
Q09G6012 1
PIN
IRPFBXB5C
IR
BOARD
052G 2191 A
PAPER TAPE
055G 23524
WELDING FLUX WITHOUT PB
U01
056G 627911
IR 38KHZ KSM-603TM2M
Q55G 100620500
TIN STICK(SN-0.5AG)
Q55G 100622
TIN STICK(SAC0507)
CN01
033G8032 6F HR
CONNECTOR 6P 1.25
052G 2191 A
PAPER TAPE
052G6026 2
MESH PRINTTING PAPER
055G 23520
IPA
055G 100610
TIN CREAM W/O PB
Содержание LE32W157
Страница 4: ...4 1 General Specification Note For this content pls refer to the user manual ...
Страница 5: ...5 2 Operating Instructions Note For this content pls refer to the user manual ...
Страница 11: ...11 5 Remove the MAIN POWER BOARD and BRACKET AC IN BRACKET BKT_SIDE BRACKET BKT_IO_BTM ...
Страница 12: ...12 6 Remove the BRACKET PANEL HOLDER and INSULATING SHEET 7 The PANEL INSULATING SHEET ...
Страница 13: ...13 8 The BEZEL ...
Страница 18: ...18 8 The PANEL and BEZEL separate the PANEL from BEZEL 9 The BEZEL ...
Страница 25: ...25 6 PCB Layout 6 1 Main Board 715G4727M0D000005K ...
Страница 26: ...26 ...
Страница 27: ...27 ...
Страница 28: ...28 6 2 Power Board LE32W157 715G4500P01W30003S ...
Страница 29: ...29 ...
Страница 30: ...30 ...
Страница 31: ...31 LE40H157 715G4581P01W30003H ...
Страница 32: ...32 ...
Страница 33: ...33 ...
Страница 34: ...34 6 3 Key Board 715G4682K0C000004S ...
Страница 35: ...35 6 4 IR Board 715G4650R01001005I ...
Страница 36: ...36 7 Adjustment It s no need ADC and WB adjustment for the two models ...
Страница 65: ...65 9 3 Key Board 715G4682K0C000004S ...
Страница 67: ...67 10 Exploded View LE32W157 ...
Страница 69: ...69 LE40H157 ...