User Guide
UG-1199
Rev. 0 | Page 11 of 11
ORDERING INFORMATION
BILL OF MATERIALS
Table 4.
Reference Designator
Description
C1 to C2
50 V tantalum capacitors, 10 µF, D size
C3 to C6, C8
50 V, X7R multilayer ceramic capacitors, 0.1 µF, 0603
C7
Capacitor, 10 µF, 0805, 16 V
D1 to D4
Not placed
S1 to S4
Not placed
T1 to T8
Red test points
GND1, GND2
Black test points
J1 to J3
4-pin terminal blocks, 5 mm pitch
J4
120-way connector, 0.6 mm pitch
J5
Through hole, header, 4 × 2, 2.54 mm
LK1, LK2
3-pin single inline (SIL) header and shorting links
R2 to R7, R12 to R15, R17, R18, R21, R22, R27, R28, R32, R34, R35 Not placed
R8 to R11, R16, R19, R20, R23 to R26, R33
Resistors, 0 Ω, 0603, 1%
R1
Resistor, 10 kΩ, 0.063 W, 1%, 0603
R29
Resistor, 1 kΩ, 0.063 W, 1%, 0603
R30, R31
Resistors, 100 kΩ, 0.063 W, 1%, 0603
SW1
Surface mount design (SMD) push button switch
U1
, SPI controlled, quad SPST switch
U2
, 1.8 V to 5.5 V, 2:1 multiplexer/single-pole, double throw (SPDT) switch
U3
32 kΩ, I
2
C serial EEPROM
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
ESD Caution
ESD (electrostatic discharge) sensitive device
. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection
circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality.
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UG16263-0-1/18(0)