Application Note
AN-695
Rev. C | Page 9 of 12
EVALUATION BOARD SCHEMATIC AND ARTWORK
Figure 9 shows the schematic of the
evaluation board (Version 4.0). Note that THPAD, shown as Pin 33 in this schematic, refers
to the exposed thermal pad underneath the chip set. Connect THPAD to AGND to dissipate heat.
04592-008
Figure 9. ADN8831 Evaluation Board Schematic