PROCESS SETUP AND ACCEPTANCE
P
ROCESS
M
ANUAL
3.4 Process acceptance conditions
The process specifications of Amtech/Tempress Systems, Inc. can only be guaranteed if the
conditions are satisfied as described in the following sections.
3.4.1
Introduction
The Tempress process is characterised with either film thickness, sheet resistivity, added particle
count, refractive index and/or dopant concentration, where applicable.
3.4.1.1 Uniformity definitions
Standard edge exclusion: 5 to 9 mm depending on wafer size and process unless otherwise stated in
the process specifications.
Table 3-2: Default edge exclusion
Wafer diameter
[mm]
Edge exclusion
[mm]
76.2 4
100 5
125 5
150 6
200 9
300 9
Minimum, maximum and average values are measured over 5 or 9 points as shown in the picture
below. Default amount of measurement points are indicated in Table 3-3.
Figure 3-4: 5 or 9 measurement point indicator
Table 3-3: Default amount of measurement points
Wafer diameter
[mm]
Measurement points
[nr]
76.2 5
100 5
125 5
150 5
200 9
300 9
3.4-1
