Alcatel-Lucent Enterprise 8088, Руководство пользователя

Страница: 14 / 30

Care must be taken in order to equilibrate the layout, to avoid that the PCB becomes curved during
soldering process (due to differential thermal expansion of the copper layers).
The cut-hole size must be defined big enough in order to get a solid solder area, and to avoid that
the copper of the hole is snatched during milling process.
The solder is
put here
Mainboard
Daughter board