10
XP-SP30
SECTION 5
DIAGRAMS
Note on Printed Wiring Board
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• MAIN board is multi-layer printed board. However, the pat-
terns of intermediate-layer have not been included in the dia-
gram.
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side A)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side B)
the parts face are indicated.
Note on Schematic Diagram:
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise specified.
•
%
: indicates tolerance.
•
C
: panel designation.
•
A
: B+ Line.
• Total current is measured with CD installed.
• Power voltage is dc 4.5 V and fed with regulated dc power supply
from DC IN jack (J201).
• Voltages and waveforms are dc with respect to ground in playback
mode.
no mark : CD PLAY
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production toler-
ances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler-
ances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
• WAVEFORMS
Note:
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
0
sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
550 mVp-p
1
IC402
if
RFAC
100mV/DIV, 400ns/DIV
2
IC402
rk
XTAO
1V/DIV, 20ns/DIV
3
IC301
2
XIN
1V/DIV, 100ns/DIV
4
IC301
qk
MSCK-O
1V/DIV, 400ns/DIV
59ns
932us
2.5 Vp-p
2.3 Vp-p
236ns
2.3 Vp-p
5
IC201
ef
SYNC
1V/DIV, 2us/DIV
5.6us
2.2 Vp-p
