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MIO-2361 User Manual
16
2.3.2.3
Another Thermal Solution - Heat Spreader
MIO-2361 has an optional heat spreader to make whole system more compact.
Using a heat spreader to conduct heat from your chassis can help a lot when the sys-
tem is extra compact or has limited space for heat convection. Here are some guide-
lines for the heat spreader:
1.
For best heat conduction, the gap between the chassis and heat spreader
should be smaller, the smaller the better.
2.
The height of the existing heat spreader is TBD (Advantech P/N: TBD). If you
need some other height to fit the chassis better, Advantech can customize it for
you. (Please contact our sales for details).
3.
Thermal grease and screws are provided in the heat spreader kit, thermal
grease helps conduct better if the chassis is quite close to heat spreader.
Another suggestion is to use a thermal pad if the chassis isn't close enough to
the heat spreader. (The gap should be less than 3mm for better heat conduc-
tion).
Содержание MIO-2361 Series
Страница 8: ...MIO 2361 User Manual viii ...
Страница 27: ...Chapter 3 3 BIOS Settings ...
Страница 53: ...Chapter 4 4 S W Introduction Installation ...
Страница 64: ...MIO 2361 User Manual 54 ...
Страница 65: ...Appendix A A PIN Assignments ...
Страница 83: ...Appendix B B WDT GPIO ...
Страница 86: ...MIO 2361 User Manual 76 ...
Страница 87: ...Appendix C C System Assignments ...