Express-TL User’s Guide
PICMG COM.0 R3.0
Page 11
Copyright © 2022 ADLINK Technology, Inc.
2.
Specifications
2.1.
Core System
CPU
11th Gen Intel® Core™, Intel® Xeon®, and Intel® Celeron® Processor (formerly “Tiger Lake-H”)
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Intel® Xeon® W-11865MRE, 2.6(4.7) GHz, 24MB, 45W(35W cTDP), 8C/16T
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Intel® Xeon® W-11865MLE, 1.5(4.5) GHz, 24MB, 25W, 8C/16T
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Intel® Core™ i7-11850HE, 2.6(4.7) GHz, 24MB, 45W(35W cTDP), 8C/16T
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Intel® Xeon® W-11555MRE, 2.6(4.5) GHz, 12MB, 45W(35W cTDP), 6C/12T
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Intel® Xeon® W-11555MLE, 1.9(4.4) GHz, 12MB, 25W, 6C/12T
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Intel® Core™ i5-11500HE, 2.6(4.5) GHz, 12MB, 45W(35W cTDP), 6C/12T
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Intel® Xeon® W-11155MRE, 2.4(4.4) GHz, 8MB, 45W(35W cTDP), 4C/8T
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Intel® Xeon® W-11155MLE, 1.8(3.1) GHz, 8MB, 25W, 4C/8T
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Intel® Core™ i3-11100HE, 2.4(4.4) GHz, 8MB, 45W(35W cTDP), 4C/8T
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Intel® Celeron® 6600HE, 2.6GHz, 8MB, 35W, 2C/2T
Supporting: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost
Technology 2.0, Intel® AVX-512, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Device Protection Technology with Intel® Secure Key,
Intel® TSX-NI (availability of features may vary between processor SKUs)
Memory
Up to 128GB DDR4 in four SODIMM sockets (two on top, two on bottom), maximum 32GB per socket, maximum 3200 MT/s.
Xeon® processors paired with RM590E Chipset can support both of ECC and non-ECC memory. Other processor/chipset combinations support non-
ECC memory. Fourth SODIMM on bottom side is supported by build option.
Note
: Top SODIMM sockets must be populated first.